Mount ChipLED. ASMT-CB00 Datasheet

ASMT-CB00 ChipLED. Datasheet pdf. Equivalent

Part ASMT-CB00
Description 0.4mm Low Profile Right Angle Surface Mount ChipLED
Feature ASMT-CB00 InGaN Blue, 0.4mm Low Profile Right Angle Surface Mount ChipLED Data Sheet Description T.
Manufacture AVAGO TECHNOLOGIES
Datasheet
Download ASMT-CB00 Datasheet




ASMT-CB00
ASMT-CB00
InGaN Blue, 0.4mm Low Profile
Right Angle Surface Mount ChipLED
Data Sheet
Description
The ASMT-CB00 of blue color chip-type LEDs is designed
with the smallest footprint to achieve high density of
components on board. They have the industry standard
www.DataSheet4fUoo.ctopmrint 1.6 mm x 1.0 mm and a height of only 0.4 mm.
This makes them very suitable for cellular phone and
mobile equipment backlighting and indication appli-
cation where space is a constraint. In order to facilitate
automated pick and place operation, these ChipLEDs are
shipped in conductive tape and reel, with 4000 units per
reel. These part are compatible with IR soldering.
Package Dimension
0.20
0.008
1.60
0.063
0.20
0.008
0.40`0.05
0.016`0.002
1.20
0.047
Features
Small size right angle mount
0603 industry standard footprint
0.4 mm low profile type
Operating temperature range of -30°C to +85 °C
Compatible with IR reflow soldering process
Available in 8mm tape on 178mm (7’) diameter reels
Reel sealed in zip locked moisture barrier bags
Applications
LCD Backlighting
Keypad Side / Backlighting
Pushbutton backlighting
Symbol Indicator
R0.60
0.024
1.00
0.039
0.50
0.020
SIDE VIEW
CATHODE MARK
0.20
0.009
0.30
0.012
TOP VIEW
0.30
0.012
0.35
0.014
0.30
0.012
0.35
0.014
TERMINAL VIEW
Notes:
1. All dimensions will be in millimeters (inches)
2. Tolerance is ±0.1mm (±0.004 in) unless otherwise stated
CAUTION: ASMT-CB00 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.



ASMT-CB00
Device Selection Guide
Package Dimension (mm)
1.6 (L) x 1.0 (W) x 0.4 (H)
Parts per Reel
4000
Package Description
Untinted, Non-diffused
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward Current [1]
Power Dissipation
Reverse Voltage (IR = 100μA)
LED Junction Temperature
www.DataSheet4UO.pceoramting Temperature Range
Storage Temperature Range
Soldering Temperature
Note:
1. Derate linearly as shown in Figure 4.
ASMT-CB00
10
32
5
95
-30 to +85
-40 to +85
See reflow soldering profile (Figure 7 & 8)
Unit
mA
mW
V
°C
°C
°C
Electrical Characteristics at TA = 25°C
Part Number
Forward Voltage
VF (Volts) [1] @ IF = 5mA
Typ. Max.
ASMT-CB00 2.85
3.15
Notes:
1. Vf tolerance : ±0.1V
Reverse Breakdown
VR (Volts) @ IR = 100μA
Min.
5
Thermal Resistance
RθJ-PIN (°C/W)
Typ.
450
Optical Characteristics at TA = 25°C
Part Number
Luminous Intensity
IV [1] (mcd) @ 5mA
Min. Typ.
Peak Wavelength
λpeak (nm)
Typ.
Dominant Wavelength
λd [2] (nm)
Typ.
Viewing Angle
2 θ1/2 [3] (Degrees)
Typ.
ASMT-CB00 7.2
18
469
473
150
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.








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