Document
ASMT-CB00
InGaN Blue, 0.4mm Low Profile Right Angle Surface Mount ChipLED
Data Sheet
Description
The ASMT-CB00 of blue color chip-type LEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard www.DataSheet4U.com footprint 1.6 mm x 1.0 mm and a height of only 0.4 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication application where space is a constraint. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in conductive tape and reel, with 4000 units per reel. These part are compatible with IR soldering.
Features
• Small size right angle mount • 0603 industry standard footprint • 0.4 mm low profile type • Operating temperature range of -30°C to +85 °C • Compatible with IR reflow soldering process • Available in 8mm tape on 178mm (7’) diameter reels • Reel sealed in zip locked moisture barrier bags
Applications
• LCD Backlighting • Keypad Side / Backlighting • Pushbutton backlighting • Symbol Indicator
Package Dimension
1.60 0.063 0.20 0.008 0.20 0.008 1.00 0.039 1.20 0.047 R0.60 0.024
0.40`0.05 0.016`0.002
0.50 0.020
SIDE VIEW
0.20 0.009 CATHODE MARK 0.30 0.012
TOP VIEW
0.30 0.012 0.35 0.014
0.30 0.012
0.35 0.014
TERMINAL VIEW
Notes: 1. All dimensions will be in millimeters (inches) 2. Tolerance is ±0.1mm (±0.004 in) unless otherwise stated
CAUTION: ASMT-CB00 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Package Dimension (mm) 1.6 (L) x 1.0 (W) x 0.4 (H) Parts per Reel 4000 Package Description Untinted, Non-diffused
Absolute Maximum Ratings at TA = 25°C
Parameter DC Forward Current [1] Power Dissipation Reverse Voltage (IR = 100μA) LED Junction Temperature
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ASMT-CB00 10 32 5 95 -30 to +85 -40 to +85 See reflow soldering profile (Figure 7 & 8)
Unit mA mW V °C °C °C
Operating Temperature Range Storage Temperature Range Soldering Temperature
Note: 1. Derate linearly as shown in Figure 4.
Electrical Characteristics at TA = 25°C
Forward Voltage VF (Volts) [1] @ IF = 5mA Part Number ASMT-CB00 Typ. 2.85 Max. 3.15 Reverse Breakdown VR (Volts) @ IR = 100μA Min. 5 Thermal Resistance RθJ-PIN (°C/W) Typ. 450
Notes: 1. Vf tolerance : ±0.1V
Optical Characteristics at TA = 25°C
Luminous Intensity IV [1] (mcd) @ 5mA Part Number ASMT-CB00 Min. 7.2 Typ. 18 Peak Wavelength λpeak (nm) Typ. 469 Dominant Wavelength λd [2] (nm) Typ. 473 Viewing Angle 2 θ1/2 [3] (Degrees) Typ. 150
Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.
Light Intensity (IV) Bin Limits
Intensity (mcd) Bin ID K L M Minimum 7.20 11.20 18.00 Maximum 11.20 18.00 28.50
Forward Voltage (VF) Bin Limits
Forward Voltage (V) Bin ID 1 2 3
Tolerance : ±0.1V
Minimum 2.55 2.75 2.95
Maximum 2.75 2.95 3.15
Tolerance : ±15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins.
Color Bin Limits
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Dominant Wavelength (nm) Minimum 460.0 465.0 470.0 475.0 Maximum 465.0 470.0 475.0 480.0
Bin ID A B C D
Tolerance : ±1nm
1 0.9
100
RELATIVE INTENSITY
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 600 650 700
FORWARD CURRENT - mA
0.8
10
1
0.1 2.0
2.5
3.0
3.5
4.0
WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength
FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage
2.0 1.8 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 mA) RELATIVE LUMINOUS INTENSITY 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2
12
10 (NORMALIZED AT 5 mA)
8
6
4
2
www.DataSheet4U.com 0
0
2
4 6 8 DC FORWARD CURRENT - mA
10
0
0
20
40
60
80
100
DC FORWARD CURRENT - mA
Figure 3. Luminous intensity vs. forward current
Figure 4. Maximum forward current vs. ambient temperature
100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 0.8 (0.031) 1.2 (0.047) 0.15 (0.006) 0.4 (0.016)
0.4 (0.016)
0.7 (0.028) CENTERING BOARD
0.8 (0.031)
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified
Figure 5. Radiation pattern
Figure 6. Recommended soldering land pattern
10 SEC. MAX. TEMPERATURE TEMPERATURE 230°C MAX. 140-160°C 4°C/SEC. MAX. OVER 2 MIN. TIME 4°C/SEC. MAX. 3°C/SEC. MAX. 255 - 260°C 3°C/SEC. MAX.
10 to 30 SEC.
217 °C 200 °C 150 °C
6°C/SEC. MAX. 3°C/SEC. MAX. 60 - 1.