Supply Applications. CMS09 Datasheet

CMS09 Applications. Datasheet pdf. Equivalent

Part CMS09
Description Switching Mode Power Supply Applications
Feature CMS09 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CMS09 Switching Mode Power Supply Ap.
Manufacture Toshiba Semiconductor
Datasheet
Download CMS09 Datasheet



CMS09
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS09
CMS09
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
Unit: mm
Forward voltage: VFM = 0.45 V (ax)
Average forward current: IF (AV) = 1.0 A
Repetitive peak reverse voltage: VRRM = 30 V
www.DataSheet4U.cSoumitable for compact assembly due to small surface-mount package
“MFLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
(Note 1)
VRRM
IF (AV)
30
1.0
(Ta = 51°C)
V
A
Peak one cycle surge forward current
(non-repetitive)
IFSM
25 (50 Hz)
A
Junction temperature
Storage temperature
Tj
40~150
°C
Tstg
40~150
°C
JEDEC
JEITA
Note 1: Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm, soldering land: 6 mm × 6 mm)
Note 2: Using continuously under heavy loads (e.g. the application of
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance
Thermal resistance
Symbol
VFM (1)
VFM (2)
VFM (3)
IRRM
IRRM
Cj
Rth (j-a)
Rth (j-)
Test Condition
IFM = 0.1 A
IFM = 0.5 A
IFM = 1.0 A
VRRM = 5 V
VRRM = 30 V
VR = 10 V, f = 1.0 MHz
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm × 6 mm)
Min
Typ. Max Unit
0.32
0.37
0.40
1.5
15.0
70
0.45
500
V
μA
pF
60
°C/W
135
16 °C/W
1 2006-11-13



CMS09
Marking
Abbreviation Code
S9
Part No.
CMS09
Standard Soldering Pad
Unit: mm
www.DataSheet4U.com
1.4
3.0
1.4
CMS09
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
IF(AV):
We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of IF(AV) and Tj be below 120°C. When using this device, take the margin into consideration by
using an allowable Tamax-IF(AV) curve.
IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a Tj of below 120°C.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2 2006-11-13







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