MD4331-Dxx

Mobile DiskOnChip G3 512Mbit/1Gbit Flash Disk with MLC NAND and M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 www.DataSheet4U.com Highlights Mobile DiskOnChip G3 is one of the industry’s most efficient storage solutions, using Toshiba’s 0.13 µm Multi-Level Cell (MLC) NAND flash technology and x2 technology from M-Systems®. MLC NAND flash technology provides the smallest die size by storing 2 bits of information in a single memory cell. x2 technology enables MLC NAND to achieve highly reliable, high-performance data and code storage with a specially designed error detection and correction mechanism, optimized file management, and proprietary algorithms for enhanced performance. Further cost benefits derive from the cost-effective architecture of Mobile DiskOnChip G3, which includes a boot block that can replace expensive NOR flash, and incorporates both the flash array and an embedded thin controller in a single die. Mobile DiskOnChip G3 provides: Flash disk for both code and data storage Low voltage: 1.8V or 3.3 I/O (auto-detect), 3V Core Hardware protection and security-enabling features High capacity: single die - 512Mb (64MB), dual die - 1Gb (128MB) Device cascade capacity: up to 2Gb (256MB) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 512Mb (64MB) capacity (single die): 48-pin TSOP-I package 85-ball FBGA 7x10 mm package 1Gb (128MB) capacity (dual die): 69-ball FBGA 9x12 mm packag...