A82DL1622T

A82DL16x2T(U) Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary www.DataSheet4U.com Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Revision History Rev. No. 0.0 0.1 History Initial issue Update Figure 23 Issue Date March 25, 2005 May 17, 2005 Remark Preliminary PRELIMINARY (May, 2005, Version 0.1) AMIC Technology, Corp. A82DL16x2T(U) Series Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary www.DataSheet4U.com DISTINCTIVE CHARACTERISTICS MCP Features Single power supply operation 2.7 to 3.6 volt High Performance - Access time as fast as 70ns Package 69-Ball TFBGA (8x11x1.4 mm) Industrial operating temperature range: -40°C to 85°C for –U; -25°C to 85°C for –I - Suspends erase operations to allow programming in same bank Data Polling and Toggle Bit - Provides a software method of detecting the status of program or erase cycles Unlock Bypass Program command - Reduces overall programming time when issuing multiple program command sequences HARDWARE FEATURES Any combination of sectors can be erased Ready/ Busy out...