(A82DL16x2T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
A82DL16x2T(U) Series
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bi...
Description
A82DL16x2T(U) Series
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary
www.DataSheet4U.com
Document Title Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Revision History
Rev. No.
0.0 0.1
History
Initial issue Update Figure 23
Issue Date
March 25, 2005 May 17, 2005
Remark
Preliminary
PRELIMINARY (May, 2005, Version 0.1)
AMIC Technology, Corp.
A82DL16x2T(U) Series
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash Memory and 2M (128Kx16 Bit) Static RAM Preliminary
www.DataSheet4U.com
DISTINCTIVE CHARACTERISTICS MCP Features
Single power supply operation 2.7 to 3.6 volt High Performance - Access time as fast as 70ns Package 69-Ball TFBGA (8x11x1.4 mm) Industrial operating temperature range: -40°C to 85°C for –U; -25°C to 85°C for –I - Suspends erase operations to allow programming in same bank Data Polling and Toggle Bit - Provides a software method of detecting the status of program or erase cycles Unlock Bypass Program command - Reduces overall programming time when issuing multiple program command sequences HARDWARE FEATURES Any combination of sectors can be erased Ready/ Busy out...
Similar Datasheet