IGBT MODULE
SPECIFICATION
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Device Name Type Name Spec. No.
: : :
IGBT MODULE
6MBI150U4B-120 MS5F 6013
Jan. 1...
Description
SPECIFICATION
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Device Name Type Name Spec. No.
: : :
IGBT MODULE
6MBI150U4B-120 MS5F 6013
Jan. 18 ’05 Jan. 18 ’05
S.Miyashita T.Miyasaka
Y.Seki
K.Yamada
MS5F6013
1
13
H04-004-07b
R e v i s e d
Date Classification Ind. Content
R e c o r d s
Applied date Issued date Drawn Checked Checked Approved
Jan.-18 - ’05
Enactment
T.Miyasaka K.Yamada
Y.Seki
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MS5F6013
2 13
H04-004-06b
6MBI150U4B-120
1. Outline Drawing ( Unit : mm )
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(
2. Equivalent circuit
shows theoretical dimension. ) shows reference dimension.
30,31,32
16,17,18
19
20
1 2 U 27,28,29 3 4 33,34,35
5 6
9 10 V 24,25,26 W 21,22,23
7 8
11 12 13,14,15
MS5F6013
3 13
H04-004-03a
3. Absolute Maximum Ratings ( at Tc= 25 C unless otherwise specified )
Items Collector-Emitter voltage Gate-Emitter voltage Symbols VCES VGES Ic Collector current Icp -Ic -Ic pulse Pc Tj Tstg Continuous 1ms Tc=25 C o Tc=80 C o Tc=25 C o Tc=80 C
o
o
Conditions
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1ms Collector Power Dissipation 1 device Junction temperature Storage temperature Isolation between terminal and copper base (*1) Viso AC : 1min. 2500 VAC voltage between thermistor and others (*2) Screw Mounting (*3) 3.5 Nm Torque (*1) All terminals should be connected together when isolation test will be done. (*2) Two thermistor terminals should be connected together, each other terminals should be connected together and shorted to base plate when isolation test will be done. (*3) ...
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