LUPA-1300 Datasheet
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LUPA-1300
1.3 M Pixel High Speed CMOS Image Sensor
Datasheet
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134
408-943-2600
Contact
[email protected]
Document # : 38-05711 Rev.**( Revision 3.1)
Page 1 of 48
LUPA-1300 Datasheet
Document history record
Issue Date 2.1 April, 2003 3.0 March, 2004
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3.1
December, 2004
Description of changes First draft. Updated timing diagrams Updated layout Updated package drawings Disclaimer Soldering and handling conditions Updated specifications Added equivalent Cypress part numbers, ordering information. Added Cypress Document # 38-05711 Rev ** in the document footer.
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134
408-943-2600
Contact
[email protected]
Document # : 38-05711 Rev.**( Revision 3.1)
Page 2 of 48
LUPA-1300 Datasheet
Table 1
of contents
OVERVIEW .............................................................................................................................. 5 MAIN FEATURES ...................................................................................................................... 5 PART NUMBER ........................................................................................................................ 6
PREAMBLE ................................................................................................................................. 5 1.1 1.2 1.3
2
SPECIFICATIONS ...................................................................................................................... 7 2.1 GENERAL SPECIFICATIONS....................................................................................................... 7 2.2 ELECTRO-OPTICAL CHARACTERISTICS ..................................................................................... 7 2.2.1 Overview ......................................................................................................................... 7 2.2.2 Features and general specifications.............................................................................. 8 2.2.3 Spectral response curve ................................................................................................. 9 2.2.4 Photo-voltaic response curve ....................................................................................... 10 2.3 ELECTRICAL SPECIFICATIONS ................................................................................................ 11 2.3.1 Absolute maximum ratings.......................................................................................... 11 2.3.2 Recommended operating conditions ........................................................................... 11
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3
SENSOR ARCHITECTURE .................................................................................................... 13 3.1 PIXEL ARCHITECTURE............................................................................................................ 14 3.2 COLUMN READOUT AMPLIFIERS............................................................................................. 15 3.3 OUTPUT AMPLIFIERS.............................................................................................................. 16 3.4 FRAME RATE AND WINDOWING .............................................................................................. 17 3.4.1 Frame rate calculation ................................................................................................ 17 3.4.2 X-Y addressing and windowing ................................................................................... 17 3.5 TEMPERATURE REFERENCE CIRCUITS .................................................................................... 18 3.5.1 Temperature diode ....................................................................................................... 18 3.5.2 Temperature module.................................................................................................... 18 3.6 SYNCHRONOUS SHUTTER ....................................................................................................... 20 3.7 NON-DESTRUCTIVE READOUT (NDR).................................................................................... 21 3.8 OPERATION AND SIGNALING .................................................................................................. 21 3.8.1 Power supplies and grounds........................................................................................ 22 3.8.2 Biasing and analog signals ......................................................................................... 24 3.8.3 Pixel array signals ....................................................................................................... 24 3.8.4 Digital signals .............................................................................................................. 26 3.8.5 Test.