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D70F3033B Dataheets PDF



Part Number D70F3033B
Manufacturers NEC
Logo NEC
Description UPD70F3033B
Datasheet D70F3033B DatasheetD70F3033B Datasheet (PDF)

User’s Manual www.DataSheet4U.com V850/SB1 , V850/SB2 32-Bit Single-Chip Microcontroller Hardware µPD703031A µPD703031AY µPD703032A µPD703032AY µPD703033A µPD703033AY µPD70F3032A µPD70F3032AY µPD70F3033A µPD70F3033AY µPD703030B µPD703030BY µPD703031B µPD703031BY µPD703032B µPD703032BY µPD703033B µPD703033BY µPD70F3030B µPD70F3030BY µPD70F3032B µPD70F3032BY µPD70F3033B µPD70F3033BY TM TM µPD703034A µPD703034AY µPD703035A µPD703035AY µPD703037A µPD703037AY µPD70F3035A µPD70F3035AY µPD70F3037A.

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User’s Manual www.DataSheet4U.com V850/SB1 , V850/SB2 32-Bit Single-Chip Microcontroller Hardware µPD703031A µPD703031AY µPD703032A µPD703032AY µPD703033A µPD703033AY µPD70F3032A µPD70F3032AY µPD70F3033A µPD70F3033AY µPD703030B µPD703030BY µPD703031B µPD703031BY µPD703032B µPD703032BY µPD703033B µPD703033BY µPD70F3030B µPD70F3030BY µPD70F3032B µPD70F3032BY µPD70F3033B µPD70F3033BY TM TM µPD703034A µPD703034AY µPD703035A µPD703035AY µPD703037A µPD703037AY µPD70F3035A µPD70F3035AY µPD70F3037A µPD70F3037AY µPD703034B µPD703034BY µPD703035B µPD703035BY µPD703036H µPD703036HY µPD703037H µPD703037HY µPD70F3035B µPD70F3035BY µPD70F3036H µPD70F3036HY µPD70F3037H µPD70F3037HY Document No. U13850EJ6V0UD00 (6th edition) Date Published February 2003 N CP(K) 1999, 2000, 2003 Printed in Japan [MEMO] www.DataSheet4U.com 2 User’s Manual U13850EJ6V0UD NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need www.DataSheet4U.com to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Purchase of NEC I C components conveys a license under the Philips I C Patent Rights to use these components in an I C system, provided that the system conforms to the I C Standard Specification as defined by Philips. 2 2 2 2 V850 Series, V850/SA1, V850/SB1, V850/SB2, IEBus, and Inter Equipment Bus are trademarks of NEC Electronics Corporation. Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/or other countries. User’s Manual U13850EJ6V0UD 3 These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to the law of that country is prohibited. • The information in this document is current as of December, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. www.DataSheet4U.com • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided .


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