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TLFGE68DGF Dataheets PDF



Part Number TLFGE68DGF
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description LED Lamps
Datasheet TLFGE68DGF DatasheetTLFGE68DGF Datasheet (PDF)

TLRME68DG(F),TLYE68DG(F),TLGE68DG(F),TLFGE68DG(F) TOSHIBA InGaAℓP LED TLRME68DG(F),TLYE68DG(F),TLGE68DG(F),TLFGE68DG(F) ○ LED Lamps for mounting on through-hole PCB using an automatic insertion machine • • • Lead(Pb)-free products (lead: Sn-Ag-Cu) 3mm package wide viewing angle Can be mounted on a PCB using an automatic insertion machine (please refer to mounting Precautions Using an Automatic Insertion Machine) InGaAℓP Emitted colors: red, yellow and green Colored, Diffusing lens Applications:.

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TLRME68DG(F),TLYE68DG(F),TLGE68DG(F),TLFGE68DG(F) TOSHIBA InGaAℓP LED TLRME68DG(F),TLYE68DG(F),TLGE68DG(F),TLFGE68DG(F) ○ LED Lamps for mounting on through-hole PCB using an automatic insertion machine • • • Lead(Pb)-free products (lead: Sn-Ag-Cu) 3mm package wide viewing angle Can be mounted on a PCB using an automatic insertion machine (please refer to mounting Precautions Using an Automatic Insertion Machine) InGaAℓP Emitted colors: red, yellow and green Colored, Diffusing lens Applications: Various types of information panels, indicators for amusement equipment and panel backlighting illumination sources Unit: mm www.DataSheet4U.com • • • • Line-up Product Name TLRME68DG(F) TLYE68DG(F) TLGE68DG(F) TLFGE68DG(F) Color Red Yellow Green Green Material JEDEC JEITA InGaAlP ― ― 4-3U1 TOSHIBA Weight: 0.15 g(Typ.) Absolute Maximum Ratings (Ta = 25°C) Product Name TLRME68DG(F) TLYE68DG(F) TLGE68DG(F) TLFGE68DG(F) Forward Current IF (mA) 50 50 50 50 Reverse Voltage VR (V) 4 4 4 4 Power Dissipation PD (mW) 120 120 120 120 −40~100 −40~120 Operating Temperature Topr (°C) Storage Temperature Tstg (°C) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 1 2007-10-01 TLRME68DG(F),TLYE68DG(F),TLGE68DG(F),TLFGE68DG(F) Electrical and Optical Characteristics (Ta = 25°C) Product Name TLRME68DG(F) TLYE68DG(F) TLGE68DG(F) TLFGE68DG(F) Unit Typ. Emission Wavelength λd λP Δλ Luminous Intensity IV Min 47.6 47.6 15.3 15.3 mcd Typ. 140 150 45 30 IF 20 20 20 20 mA Forward Voltage VF Typ. 1.9 2.0 2.0 2.0 V Max 2.4 2.4 2.4 2.4 IF 20 20 20 20 mA Reverse Current IR Max 50 50 50 50 μA IF 20 20 20 20 mA VR 4 4 4 4 V 626 587 571 565 (636) (590) (574) (568) nm 23 17 17 15 www.DataSheet4U.com Precautions • These LED lamps made of InGaAlP will also emit some IR light. If a photodetector is located near an LED lamp, please ensure that it will not be affected by this IR light. • Manual soldering should be performed within 3 s at a maximum temperature of 300°C or 5 s at a maximum temperature of 260°C. • When forming the leads, bend each lead without applying any forming stress. Soldering must be performed after the leads have been formed. Mounting Precautions Using an Automatic Insertion Machine (1) These newly designed LED lamps are intended for mounting on both through-hole PCBs by means of an automatic mounting machine. Compared to conventional φ3-mm LED lamps, they are less prone to the effects of stress during automat.


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