Document
Bulletin I27140 rev. E 10/02
IRK.56, .71 SERIES
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STANDARD DIODES Features
High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage
ADD-A-pakTM GEN V Power Modules Benefits
Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded
60 A 80 A
Mechanical Description
The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread. The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible direct stress on the leads. The electrical terminals are secured against axial pull-out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.
Electrical Description
These modules are intended for general purpose high voltage applications such as high voltage regulated power supplies, lighting circuits, temperature and motor speed control circuits, UPS and battery charger.
Major Ratings and Characteristics
Parameters
IF(AV) @ 100°C IF(RMS) IFSM @ 50Hz @ 60Hz I t @ 50Hz @ 60Hz I √t VRRM range TJ TSTG
2 2
IRK.56
60 94 1600 1680 12.89 11.76 128.9
IRK.71
80 126 1790 1870 15.90 14.53 159
Units
A A A A KA 2s KA 2s KA2√s V
o
400 to 1600 - 40 to 150 - 40 to150
C C
o
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IRK.56, .71 Series
Bulletin I27140 rev. E 10/02
ELECTRICAL SPECIFICATIONS Voltage Ratings
Voltage Type number Code
04 06
VRRM , maximum repetitive peak reverse voltage V
400 600 800 1000 1200 1400 1600
VRSM , maximum nonrepetitive peak rev. voltage V
500 700 900 1100 1300 1500 1700
IRRM max.
@ 150°C
mA
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IRK.56/ .71
08 10 12 14 16
10
Forward Conduction
Parameter
I F(AV) I F(AV) Max. average forward current @ Case temperature Max. average forward current @ Case temperature I F(RMS) Max. RMS forward current I FSM Max. peak, one-cycle forward, non-repetitive surge current
IRK.56
60 100 55 105 94 1600 1680 1350 1420
IRK.71
80 100 70 108 126 1790 1870 1500 1570 15.90 14.53 11.25 10.23 159.0 0.83
Units
A °C A °C A
Conditions
180° conduction, half sine wave
180° conduction, half sine wave
DC @ 92°C case temperature t = 10ms No voltage reapplied 100% VRRM reapplied No voltage reapplied 100% VRRM reapplied Sinusoidal half wave, Initial TJ = TJ max.
A
t = 8.3ms t = 10ms t = 8.3ms t = 10ms
It
2
Maximum I t for fusing
2
12.89 11.76 9.12 8.32
KA2s
t = 8.3ms t = 10ms t = 8.3ms
I √t
2
Maximum I √t for fusing
2
128.9 0.96 1.03 2.81 2.48 1.51
KA √s
2
t = 0.1 to 10ms, no voltage reapplied (16.7% x π x IF(AV) < I < π x IF(AV)), TJ = TJ max.
V F(TO)1 Low level value of threshold voltage V F(TO)2 High level value of threshold voltage r f1 Low level value of forward slope resistance r f2 V FM High level value of forward slope resistance Max. forward voltage drop
V 0.92 2.68 mΩ 2.40 1.50 V (I > x π x IF(AV)), TJ = TJ max. (16.7% x π x IF(AV) < I < π x IF(AV)), TJ = TJ max. (I > x π x IF(AV)), TJ = TJ max. IFM = π x IF(AV), TJ = 25°C, tp = 400µs square wave
Blocking
Parameter
IRRM VINS Max. peak reverse leakage current RMS isolation voltage
IRK.56
10
IRK.71
Units
mA V
Conditions
TJ = 150oC 50 Hz, circuit to base, all terminals shorted
3500 (1 sec)
2
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IRK.56, .71 Series
Bulletin I27140 rev. E 10/02
Thermal and Mechanical Specifications
Parameter
TJ Tstg Junction temperature range Storage temperature range Max. thermal resistance, junction to case Typical thermal resistance, case to heatsink Mounting tourque ±10% to heatsink busbar Approximate weight Case style
IRK.56
IRK.71
Units
°C °C K/W K/W
Conditions
-40 to 150 -40 to 150 0.5 0.1 0.4
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R thJC R thCS T
Per junction, DC operation Mounting surface flat, smooth and greased A mounting compound is recommended and the torque should be rechecked after a period of 3 hours to allow for the spread of the compound
5 4 110 (4) TO-240AA
Nm gr (oz)
wt
JEDEC
∆R Conduction (per Junction)
(The following table shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC)
Devices
180o IRK.56 IRK.71 0.11 0.06
Sine half wave conduction
120o 0.13 0.08 90o 0.16 0.11 60o 0.22 0.14 30o 0.32 0.21 180o 0.09 0.06
Rect. wave conduction
120o 0.14 0.09 90o 0.17 0.11 60o 0.23 0.15 30o 0.32 0.21
Units
°C/W
Ordering Information Table
Device Code
IRK
1
D
2
71
3
/
16
4
A
5
1 2 3 4 5
-
Module type Circuit configuration (See Circuit Configuration Table) Current code Voltage code (See Voltage Ratings Table) A: Gen V
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IRK.56, .71 Series
Bulletin I27140 rev. E 10/.