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MC12U032HACA Dataheets PDF



Part Number MC12U032HACA
Manufacturers Samsung semiconductor
Logo Samsung semiconductor
Description MultiMediaCard Specification
Datasheet MC12U032HACA DatasheetMC12U032HACA Datasheet (PDF)

MultiMediaCardTM MultiMediaCard Specification www.DataSheet4U.com Version : Ver. 0.9 Date 4 – June - 2004 Samsung Electronics Co., LTD Semiconductor Flash Memory Product Planning & Applications 1 MultiMediaCardTM Revision History Revision No. 0.0 0.1 History 1. Initial Draft 1. 2. 3. 1. 2. 1. 2. 3. 1. 2. 3. 1. 2. 1. 2. 1. 2. 0.8 0.9 1. Changed CSD filed Added Command Response Timing Added SPI Bus Timing Added Ordering Information (page 6) Added Power Consumption (page 13) Changed CSD field .

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Document
MultiMediaCardTM MultiMediaCard Specification www.DataSheet4U.com Version : Ver. 0.9 Date 4 – June - 2004 Samsung Electronics Co., LTD Semiconductor Flash Memory Product Planning & Applications 1 MultiMediaCardTM Revision History Revision No. 0.0 0.1 History 1. Initial Draft 1. 2. 3. 1. 2. 1. 2. 3. 1. 2. 3. 1. 2. 1. 2. 1. 2. 0.8 0.9 1. Changed CSD filed Added Command Response Timing Added SPI Bus Timing Added Ordering Information (page 6) Added Power Consumption (page 13) Changed CSD field (page 22) Changed command class (page 30) Added operating characteristics (page 14) Changed ordering information (page 6) Changed memory array structure (page 9) Change C_SIZE and C_SIZE_MULT(page 26) Changed CSD information (page 22,23) Deleted paragraphs regarding stream read and partial read/write Added dimensions of RS-MMC Added product code of RS-MMC Added product code of MMC using S3C49M8X01 controller Added product code of programmable CID MMC using S3C49M8X01 controller Changed controller type for all kinds of MMC Draft Date November 29th 2001 March 15th 2002 June 21st 2002 November 23rd 2002 April 7th 2003 April 26th 2003 November 12th 2003 December 2nd 2003 Remark Preliminary Preliminary 0.2 www.DataSheet4U.com Preliminary Preliminary 0.3 0.4 Advanced 0.5 0.6 0.7 February 16th 2004 June 4th 2004 1. Changed product model - Changed from “no lead free” to “lead free” for NAND Flash PKG (page 5,6) 2. Changed CSD Field (page23) 3. Changed ERASE_GRP_SIZE (page27) 2 MultiMediaCardTM 1 1.1 1.2 Introduction to the MultiMediaCard ----------------------------------------------------------- 5 System Features ----------------------------------------------------------------------------------------- 5 Product Model -------------------------------------------------------------------------------------- 5 2 Function Description ------------------------------------------------------------------------------- 7 2.1 Flash Technology Independence ------------------------------------------------------------------ 7 2.2 Defect and Error Management --------------------------------------------------------------------- 7 2.3 Endurance ----------------------------------------------------------------------------------------------- 7 2.4 Automatic Sleep Mode ------------------------------------------------------------------------------- 7 2.5 Hot Insertion -------------------------------------------------------------------------------------------- 8 www.DataSheet4U.com 2.6 MultiMediaCard Mode -------------------------------------------------------------------------------- 8 2.6.1 MultiMediaCard Standard Compliance ----------------------------------------------------------- 8 2.6.2 Negotiation Operation Conditions ----------------------------------------------------------------- 8 2.6.3 Card Acquisition and Identification ---------------------------------------------------------------- 8 2.6.4 Card Status -------------------------------------------------------------.


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