Document
Temperature Measurement SMD NTC Thermistors with Silver Palladium Termination, Size 0805
Applications
I Temperature measurement and
B57620 C 620
1,25±0,15
1,3 max.
Features
I Silver palladium termination (AgPd) I Cost-effective I Suitable for wave and reflow soldering
Termination
0,5±0,25
compensation in – hybrid circuits – data systems – telecom systems – automotive electronics
2,0±0,2
TNT0397-7-E
Options www.DataSheet4U.com Alternative resistance ratings and resistance tolerance < 5% available on request Delivery mode Blister tape, 180-mm reel, PU: 4000 pcs Climatic category (IEC 60068-1) Max. power at 25 °C (on PCB) Resistance tolerance Rated temperature B value tolerance Dissipation factor (on PCB) Thermal cooling time constant (on PCB) Heat capacity R 25 No. of R/T characteristic 3207 3204 3205 3206 3206 1304 1010 B 25/50 K 3060 3190 3270 3420 3420 3250 3470 P25 ∆R N/R N TN ∆B/B δth1) τc1) Cth1) B25/85 K 3090 3250 3290 3440 3440 3280 3510
Dimensions in mm Approx. weight 13 mg
55/125/21 210 ± 5 %, ± 10 %, ± 20 % 25 ±3% approx. 3,5 approx. 10 approx. 35 B 25/100 K 3100 3250 3300 3450 3450 3300 3530
mW
°C
mW/K s mJ/K
Ordering code
Ω
220 330 470 680 1k 2,2 k 4,7 k
B57620C0221+062 B57620C0331+062 B57620C0471+062 B57620C0681+062 B57620C0102+062 B57620C0222+062 B57620C0472+962
+: J for ∆RN/RN = ± 5 % K for ∆RN/RN = ± 10 % M for ∆RN/RN = ± 20 %
1) Depends on mounting situation
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Temperature Measurement SMD NTC Thermistors with Silver Palladium Termination, Size 0805
B57620 C 620
R 25
No. of R/T characteristic 1011 2003 2101 2903 2904
B 25/50 K 3660 3930 4030 4120 4230
B 25/85 K 3730 3960 4080 4190 4280
B 25/100 K 3730 3980 4100 4200 4300
Ordering code
Ω
10 k 22 k 47 k 100 k 220 k
B57620C0103+062 B57620C0223+062 B57620C0473+062 B57620C0104+162 B57620C0224+062
+: J for ∆RN/RN = ± 5 % K for ∆RN/RN = ± 10 % M for ∆RN/RN = ± 20 %
www.DataSheet4U.com Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1. Test Storage in dry heat Standard IEC 60068-2-2 JIS C 0021 IEC 60068-2-3 JIS C 0022 IEC 60068-2-14 JIS C 0025 Test conditions Storage at upper category temperature T: (125 ± 2) °C t: 1000 h Temperature of air: (40 ± 2) °C Relative humidity of air: (93 +2/ – 3) % Duration: 21 days
∆R25/R 25 (typical)
< 3 %/ < 6 % 1)
Remarks
Storage in damp heat, steady state
<3%
No visible damage
Rapid temperature cycling Endurance
Lower test temperature: – 55 °C < 3 % Upper test temperature: 125 °C Number of cycles: 10 Pmax: 210 mW T: (65 ± 2) °C t: 1000 h <5%
Solderability
IEC 60068-2-58 JIS C 0054
Solderability: (215 ± 3) °C / (3 ± 0,3) s (235 ± 5) °C / (2 ± 0,2) s Resistance to soldering heat: (260 ± 5) °C / (10 ± 1) s
95 % of terminations wetted
Resistance drift after soldering
Reflow soldering profile Wave soldering profile
<5%
1) The higher value applies to 220 Ω – 1 kΩ types.
59
05/02
Herausgegeben von EPCOS AG .