OM5926HN

INTEGRATED CIRCUITS DATA SHEET www.DataSheet4U.com OM5926HN I2C-bus SIM card interface Product specification 2003 Feb 19 Philips Semiconductors Product specification I2C-bus SIM card interface CONTENTS 1 2 3 4 www.DataSheet4U.com OM5926HN FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION QUICK REFERENCE DATA BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description FUNCTIONAL DESCRIPTION I2C-bus control Power supply DC-to-DC converter Power-down mode Off mode Sequencer and clock counter Clock circuitry Protection I/O circuitry LIMITING VALUES HANDLING THERMAL CHARACTERISTICS CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS PURCHASE OF PHILIPS I2C COMPONENTS 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 15.5 16 17 18 19 2003 Feb 19 2 Philips Semiconductors Product specification I2C-bus SIM card interface 1 FEATURES OM5926HN Subscriber Identification Module (SIM) card interface in accordance with GSM11.11, GSM11.12 (Global System for Mobile communication) and ISO 7816 requirements VCC regulation (3 or 5 V ±8%) with controlled rise and fall times One protected and buffered pseudo-bidirectional I/O line www.DataSheet4U.com (I/O referenced to VCC and SIMI/O referenced to V...