IXGH22N50BU1S

Preliminary data HiP erF AST HiPerF erFAST with Diode Combi P ac k Pac ack TM IGBT IXGH22N50B U1 IXGH22N50BU1 IXGH22N50B U1S IXGH22N50BU1S VCES IC(25) VCE(sat)typ tfi(typ) TO-247 SMD* = 500 V = 44 A = 2.1 V = 55 ns www.DataSheet4U.com Symbol Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 22 Ω Clamped inductive load, L = 100 µH TC = 25°C Maximum Ratings 500 500 ±20 ±30 44 22 88 ICM = 44 @ 0.8 VCES 150 -55 ... +150 150 -55 ... +150 300 V V V V A A A A W °C °C °C °C TO-247 AD G E C (TAB) VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSOA) PC TJ TJM Tstg C (TAB) G C E C = Collector, TAB = Collector G = Gate, E = Emitter, *Add suffix letter "S" for surface mountable package Maximum Lead and Tab temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Md Weight Mounting torque, TO-247 AD TO-247 SMD TO-247 AD 1.13/10 Nm/lb.in. 4 6 g g Features International standard packages JEDEC TO-247 SMD surface mountable and JEDEC TO-247 AD High frequency IGBT and antiparallel FRED in one package High current handling capability HiPerFASTTM HDMOSTM process MOS Gate turn-on - drive simplicity Applications Uninterruptible power supplies (UPS) Switched-mode and resonant-mode power supplies AC motor speed control DC servo and robot drives DC choppers Advantages Space savings (two devices in one package) High power density Suitable for surface mountin...