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FREQUENCY DOUBLER. HMC-XDB112 Datasheet |
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Typical Applications
This HMC-XDB112 is ideal for:
2 • Point-to-Point Radios
• VSAT
• Test Instrumentation
• Military & Space
www.DataSheet4U.c•omClock Generation
HMC-XDB112
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 10 - 15 GHz INPUT
Features
Conversion Loss: 13 dB
Passive: No DC Bias Required
Input Drive: +13 dBm
High Fo Isolation: 30 dB
Die Size: 2.2 x 0.65 x 0.1 mm
Functional Diagram
General Description
The HMC-XDB112 is a monolithic Passive Frequency
Doubler which utilizes GaAs Heterojunction Bipolar
Transistor (HBT) technology, and is targeted to high
volume applications where frequency doubling of a
lower frequency is more economical than directly
generating a higher frequency. All bond pads and
the die backside are Ti/Au metallized and the HBT
devices are fully passivated for reliable operation. The
HMC-XDB112 Passive Doubler MMIC is compatible
with conventional die attach methods, as well as
thermocompression and thermosonic wire bonding,
making it ideal for MCM and hybrid microcircuit
applications. All data shown herein is measured with
the chip in a 50 Ohm environment and contacted with
RF probes.
Electrical Specifications*, TA = 25 °C, Pin = +13 dBm
Parameter
Min.
Frequency Range Input
Frequency Range Output
Conversion Loss
Fo Isolation with respect to output
*Unless otherwise indicated, all measurements are from probed die
Typ.
10 - 15
20 - 30
13
30
Max.
Units
GHz
GHz
dB
dB
2 - 68
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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v00.0907
Conversion Loss
0
-2
-4
-6
-8
-10
-12
www.DataSheet4U.com-14
-16
-18
-20
10
11 12 13
FREQUENCY (GHz)
14
15
HMC-XDB112
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 10 - 15 GHz INPUT
Output Power
5
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
10
Fin
2xFin
11 12 13 14
INPUT FREQUENCY (GHz)
15
2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2 - 69
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Outline Drawing
2
www.DataSheet4U.com
v00.0907
HMC-XDB112
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 10 - 15 GHz INPUT
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
WP - 4
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
2 - 70
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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