FREQUENCY MULTIPLIER. HMC-XDH158 Datasheet

HMC-XDH158 MULTIPLIER. Datasheet pdf. Equivalent


Hittite Microwave Corporation HMC-XDH158
v01.1207
Typical Applications
2 This HMC-XDH158 is ideal for:
• Short-Haul / High Capacity Radios
• Point-to-Point Radio
• Test & Measurement Equipment
• SATCOM
www.DataSheet4U.coMmilitary and Secure Communications
HMC-XDH158
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
Features
Output Power: -6 dBm
Wide Input Power Range: 0 to +5 dBm
High Fo Isolation: 30 dBc
Low Conversion Loss: 8 dB
Die Size: 1.8 x 0.8 x 0.1 mm
Functional Diagram
General Description
The HMC-XDH158 is a monolithic X4 Active Fre-
quency Multiplier which utilizes GaAs High Electron
Mobility Transistor (HEMT) technology and exhib-
its low conversion loss and high Fo isolation. This
wideband multiplier is ideal for use in LO multiplier
chains for high capacity and SATCOM radios yield-
ing reduced parts count vs. traditional approaches. All
bond pads and the die backside are Ti/Au metallized
and the HEMT devices are fully passivated for reliable
operation. The HMC-XDH158 X4 Active Frequency
Multiplier MMIC is compatible with conventional die
attach methods, as well as thermocompression and
thermosonic wire bonding, making it ideal for MCM
and hybrid microcircuit applications. All data shown
herein is measured with the chip in a 50 Ohm environ-
ment and contacted with RF probes.
Electrical Specifications*
TA = 25 °C, Vdd1 = 1.5V, Vdd2 = 4V, Vgg1 = -0.2V, Vgg2 = -0.3V, +2 dBm Drive Level
Parameter
Min.
Frequency Range Input
Frequency Range Output
Output Power
Conversion Loss
Fo Isolation with respect to output
2Fo Isolation with respect to output
Supply Current
Idd1
Idd2
*Unless otherwise indicated, all measurements are from probed die
Typ.
14 - 16
56 - 64
-6
8
36
54
14
115
Max.
14
Units
GHz
GHz
dBm
dB
dB
dB
mA
mA
2 - 74
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com


HMC-XDH158 Datasheet
Recommendation HMC-XDH158 Datasheet
Part HMC-XDH158
Description GaAs MMIC X4 ACTIVE FREQUENCY MULTIPLIER
Feature HMC-XDH158; HMC-XDH158 v01.1207 GaAs MMIC X4 ACTIVE FREQUENCY MULTIPLIER, 54 - 64 GHz OUTPUT Features Output Po.
Manufacture Hittite Microwave Corporation
Datasheet
Download HMC-XDH158 Datasheet




Hittite Microwave Corporation HMC-XDH158
v01.1207
HMC-XDH158
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
x4 Conversion Loss vs. Frequency
-5
-6
-7
-8
-9
-10
-11
www.DataSheet4U.com-12
-13
-14
-15
14
14.5 15 15.5
FREQUENCY (GHz)
16
Output Power vs. Frequency
0
-10
-20
-30
-40 4F F
3F 2F
-50
-60
14
14.5 15 15.5
FREQUENCY (GHz)
16
2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2 - 75



Hittite Microwave Corporation HMC-XDH158
v01.1207
Absolute Maximum Ratings
2
RF Input Level
Supply Voltage (Vdd1, Vdd2)
+7 dBm
+5 Vdc
Gate Voltage (Vgg1, Vgg2)
-1 to 0.3 Vdc
Channel Temperature
180 °C
Storage Temperature
-65 to +150 °C
www.DataSheet4U.coOmperating Temperature
-55 to +85 °C
Outline Drawing
HMC-XDH158
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
WP - 8
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
2 - 76
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com







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