TRIAC 2.0 Amp
PROCESS
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CPQ057
TRIAC
2.0 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness ...
Description
PROCESS
www.DataSheet4U.com
CPQ057
TRIAC
2.0 Amp, 600 Volt TRIAC Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 3,374 PRINCIPAL DEVICE TYPES CQ92-2M CQ223-2M CQ89-2M Glass Passivated Mesa 57 x 57 MILS 8.6 MILS ± 0.6 MILS 28 x 16 MILS 10 x 9 MILS Al - 45,000Å Al/Mo/Ni/Ag - 32,000Å
BACKSIDE MT2
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R0 (29 -March 2005)
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