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BTN3904A3 Dataheets PDF



Part Number BTN3904A3
Manufacturers Cystech Electonics
Logo Cystech Electonics
Description General Purpose NPN Epitaxial Planar Transistor
Datasheet BTN3904A3 DatasheetBTN3904A3 Datasheet (PDF)

CYStech Electronics Corp. General Purpose NPN Epitaxial Planar Transistor BTN3904A3 Spec. No. : C228A3 Issued Date : 2003.10.30 Revised Date : 2016.09.05 Page No. : 1/6 Description • The BTN3904A3 is designed for general purpose switching amplifier applications. • Complementary to BTP3906A3. • Pb-free lead plating package. Symbol BTN3904A3 Outline TO-92 B:Base C:Collector E:Emitter EBC Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-B.

  BTN3904A3   BTN3904A3


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CYStech Electronics Corp. General Purpose NPN Epitaxial Planar Transistor BTN3904A3 Spec. No. : C228A3 Issued Date : 2003.10.30 Revised Date : 2016.09.05 Page No. : 1/6 Description • The BTN3904A3 is designed for general purpose switching amplifier applications. • Complementary to BTP3906A3. • Pb-free lead plating package. Symbol BTN3904A3 Outline TO-92 B:Base C:Collector E:Emitter EBC Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC Pd RθJA Tj Tstg BTN3904A3 Limits 60 40 6 200 625 200 150 -55~+150 Unit V V V mA mW °C/W °C °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C228A3 Issued Date : 2003.10.30 Revised Date : 2016.09.05 Page No. : 2/6 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICEX *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Cob Min. 60 40 6 0.65 40 70 100 60 30 300 - Typ. 0.07 0.13 0.8 0.85 - Max. 50 0.2 0.3 0.85 0.95 300 4 Unit V V V nA V V V V MHz pF Test Conditions IC=10μA IC=1mA IE=10μA VCE=30V, VBE=-3V IC=10mA, IB=1mA IC=50mA, IB=5mA IC=10mA, IB=1mA IC=50mA, IB=5mA VCE=1V, IC=100μA VCE=1V, IC=1mA VCE=1V, IC=10mA VCE=1V, IC=50mA VCE=1V, IC=100mA VCE=20V, IC=10mA, f=100MHz VCB=5V, IE=0A,f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Ordering Information Device BTN3904A3-0-TB-X BTN3904A3-0-BK-X Package TO-92 (Pb-free lead plating package) TO-92 (Pb-free lead plating package) Shipping 2000 pcs / Tape & Box 1000 pcs/ bag, 10 bags/box, 10boxes/carton Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TB :2000 pcs/tape & box; BK: 1000 pcs / bag, 10 bags/box, 10 boxes/carton Product rank, zero for no rank products Product name BTN3904A3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C228A3 Issued Date : 2003.10.30 Revised Date : 2016.09.05 Page No. : 3/6 Typical Characteristics Current Gain vs Collector Current 1000 HFE@VCE=1V Saturation Voltage vs Collector Current 1000 VCE(SAT)@IC=10IB 100 100 Saturation Voltage---(mV) Current Gain---HFE 10 0.1 1 10 100 Collector Current ---IC(mA) 1000 10000 Saturation Voltage vs Collector Current VBE(SAT)@IC=10IB 1000 10 0.1 1000 1 10 100 Collector Current---IC(mA) 1000 Cutoff Frequency vs Collector Current VCE=20V Cutoff Frequency---fT(MHz) Saturation Voltage---(mV) Power Dissipation---PD(mW) 100 0.1 700 600 500 400 300 200 100 0 0 1 10 100 Collector Current ---IC(mA) Power Derating Curve 1000 50 100 150 Ambient Temperature---TA(℃) 200 Collector Output Capacitance--Cob(pF) 100 1 10 Collector Current---IC(mA) 100 Outpur Capacitance vs Reverse-biased Voltage 10 f=1MHz 1 0.1 1 10 Reverse-biased Voltage---VCB(V) 100 BTN3904A3 CYStek Product Specification CYStech Electronics Corp. TO-92 Taping Outline H2 H2 H2AH2A D2 A Spec. No. : C228A3 Issued Date : 2003.10.30 Revised Date : 2016.09.05 Page No. : 4/6 H3 L L1 F1F2 T2 P1 TP T1 H4 H H1 W1 W D1 D P2 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch Millimeters Min. Max. 4.33 4.83 3.80 4.20 0.36 0.53 4.33 4.83 2.40 2.90 - ±0.3 15.50 16.50 8.50 9.50 -1 -1 - 27 - 21 - 11 2.50 - 12.50 12.90 5.95 6.75 50.30 51.30 - 0.55 - 1.42 0.36 0.68 17.50 19.00 5.00 7.00 253 255 BTN3904A3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C228A3 Issued Date : 2003.10.30 Revised Date : 2016.09.05 Page No. : 5/6 Recommended wave soldering condition Product Peak Temperature Pb-free devices 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : Al.


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