Document
CYStech Electronics Corp.
General Purpose NPN Epitaxial Planar Transistor
BTN3904N3
Spec. No. : C228N3-H Issued Date : 2002.05.11 Revised Date : 2019.11.21 Page No. : 1/7
Description
The BTN3904N3 is designed for general purpose switching amplifier applications. Complementary to BTP3906N3. ESD JEDEC rated HBM class 3B(>8KV). Pb-free lead plating and halogen-free package
Symbol
BTN3904N3
Outline
SOT-23
B:Base C:Collector E:Emitter
Absolute Maximum Ratings (Ta=25C)
Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation (TA=25C) Power Dissipation (TC=25C) Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Junction Temperature Storage Temperature
Note : Free air condition
BTN3904N3
Symbol VCBO VCEO VEBO IC PD PD RθJA RθJC Tj
Tstg
Limits 60 40 6 200 225 (Note) 560 556 (Note) 223 150
-55~+150
Unit V V V mA mW mW
C/W C/W
C C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C228N3-H Issued Date : 2002.05.11 Revised Date : 2019.11.21 Page No. : 2/7
Characteristics (Ta=25C)
Symbol
Min. Typ. Max. Unit
Test Conditions
BVCBO
60
-
- V IC=10μA
BVCEO BVEBO
40 6
-
- V IC=1mA - V IE=10μA
ICEX - - 50 nA VCE=30V, VBE=-3V
*VCE(sat)1
-
0.1 0.2
V IC=10mA, IB=1mA
*VCE(sat)2
-
0.15 0.3
V IC=50mA, IB=5mA
*VBE(sat)1
0.65
0.75
0.85
V IC=10mA, IB=1mA
*VBE(sat)2 *hFE1
40
0.85 0.95 --
V IC=50mA, IB=5mA VCE=1V, IC=100μA
*hFE2
70
-
-
VCE=1V, IC=1mA
*hFE3
100
-
300
VCE=1V, IC=10mA
*hFE4
60
-
-
VCE=1V, IC=50mA
*hFE5
30
-
-
VCE=1V, IC=100mA
fT 300 -
- MHz VCE=20V, IC=10mA, f=100MHz
Cob - - 4 pF VCB=5V, IE=0A,f=1MHz
*Pulse Test: Pulse Width 380μs, Duty Cycle2%
Ordering Information
Device BTN3904N3-0-T1-G
Package
SOT-23 (Pb-free lead plating and halogen-free package)
Shipping 3000 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel
Product rank, zero for no rank products
Product name
BTN3904N3
CYStek Product Specification
CYStech Electronics Corp.
Recommended Soldering Footprint
Spec. No. : C228N3-H Issued Date : 2002.05.11 Revised Date : 2019.11.21 Page No. : 3/7
BTN3904N3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C228N3-H Issued Date : 2002.05.11 Revised Date : 2019.11.21 Page No. : 4/7
Characteristic Curves
10000
Saturation Voltage vs Collector Current VBE(SAT)@IC=10IB
Current Gain vs Collector Current 1000
HFE@VCE=1V
1000
100
Current Gain---HFE
Saturation Voltage-(mV)
100 0.1
1 10 100 Collector Current ---IC(mA)
1000
1000
Saturation Voltage vs Collector Current VCE(SAT)@IC=10IB
10 0.1
1 10 100 Collector Current ---IC(mA)
1000
10000
Cutoff Frequency vs Collector Current VCE=20V
100 1000
Cutoff Frequency(MHz)
Saturation Voltage-(mV)
10 0.1
1 10 100 Collector Current---IC(mA)
1000
Power Dissipation---PD (mW)
250 200 150 100 50
0 0
BTN3904N3
Power Derating Curve
50 100 Ambient Temperature---TA(℃ )
150
100 1
10 Collector Current---IC(mA)
100
CYStek Product Specification
Reel Dimension
CYStech Electronics Corp.
Spec. No. : C228N3-H Issued Date : 2002.05.11 Revised Date : 2019.11.21 Page No. : 5/7
Carrier Tape Dimension
BTN3904N3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C228N3-H Issued Date : 2002.05.11 Revised Date : 2019.11.21 Page No. : 6/7
Recommended wave soldering condition
Product
Peak Temperature
Pb-free devices
260 +0/-5 C
Soldering Time 5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Sn-Pb eutectic Assembly
Pb-free Assembly
Average ramp-up rate (Tsmax to Tp)
3C/second max.
3C/second max.
Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max)
100C 150C 60-120 seconds
150C 200C 60-180 seconds
Time maintained above: −Temperature (TL) − Time (tL)
183C 60-150 seconds
217C 60-150 seconds
Peak Temperature(TP)
240 +0/-5 C
260 +0/-5 C
Time within 5C of actual peak temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6C/second max.
6C/second max.
Time 25 C to peak temperature
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTN3904N3
CYStek Product Specification
CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C228N3-H Issued Date : 2002.05.11 Revised Date : 2019.11.21 Page No. : 7/7
Marking:
3 Date Code
3 12
XX
1TAE
1 Device Code
2
3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3
Style: Pin 1.Base 2.Emitter 3.Collector
DIM
Millimeters Min. Max.
Inches Min. Max.
DIM
Millimeters Min. Max.
Inches Min. Max.
A 0.900 1.150 0.035 0.045 E1 2.250 2.550 0.089 0.100
A1 0.000 0.100 0.000 0.004 e
0.950 TYP
0.037 TYP
A2 0.900 1.050 0..