WED3C7410E16M-400BX

www.datasheet4u.com White Electronic Designs WED3C7410E16M-400BX The WED3C7410E16M-400BX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems. *This data sheet describes a product that is developmental, is not qualified or characterized and is subject to change without notice. RISC Microprocessor Multichip Package *PRELIMINARY OVERVIEW The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management. The WED3C7410E16M-400BX multichip package consists of: 7410E AltiVec RISC processor Dedicated 2MB SSRAM L2 cache, configured as 256Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Maximum Core frequency = 400MHz @ 1.8V Maximum L2 Cache frequency = 200MHz Maximum 60x Bus frequency = 100MHz FEATURES n Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX n Implementation of Altivec technology instruction set n Optional, high-bandwidth MPX bus interface FIG. 1 MULTI-CHIP PACKAGE DIAGRAM AltiVec is a trademark of Motorola Inc. October 2002 Rev. 5 1 White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com FIG. 2 Instruction MMU Branch Processing Unit BTIC (64 Entry) Tags LR Data MMU EA www...