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Low Capacitance TVS for Ethernet and Telecom Interfaces
Features
Transient protection for high-speed data lines to
Bellcore 1089 (Intra-Building) 100A (2/10μs) IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) L5, 95A (8/20μs) Protects two lines in common and differential mode Low capacitance (12pF line-to-line) Low operating voltages (6V) Low clamping voltage Small SLP Package saves board space Solid-state technology
TClamp0602N
PROTECTION PRODUCTS - TransClampΤΜ Description
A TransClampΤΜ is a low capacitance TVS array designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and Lightning. These devices integrate low capacitance, surge-rated compensation diodes with a high power transient voltage suppressor (TVS). The compensation diodes are arranged in a bridge pattern allowing the device to be connected in common mode and/or differential mode. This allows the designer maximum flexibility and reduces parts count. The capacitance of the device is limited to 12pF maximum from line-to-line to ensure correct signal transmission on high-speed lines. These devices may be used to meet Bellcore GR-1089CORE short-haul (intra-building) surge requirements and will withstand a minimum 100 A surge for a 2/10μs pulse. The TClampTM0602N is in a 10-pin, RoHS/WEEE compliant, SLP2626P10 package. It measures 2.6 x 2.6 x 0.60mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They are particularly well suited for applications where board space is at a premium such as integrated connectors/ magnetics and T1/E1 equipment.
Mechanical Characteristics
SLP2626P10 10L package RoHS/WEEE Compliant Nominal Dimensions: 2.6 x 2.6 x 0.60 mm Lead Pitch: 0.5mm Molding compound flammability rating: UL 94V-0 Marking: Marking Code Packaging: Tape and Reel
Applications
T1/E1 T3/E3 10/100 Ethernet Integrated Magnetics Carrier Class Equipment ISDN Interfaces
Circuit Diagram
LINE 1 (1, 2, 3)
Package Configuration
2.60
1 2 C L
2.60 C L
Center Tab
0.50 BSC
LINE 2 (8, 9, 10)
0.60
10 Pin SLP package (Bottom Side View) Nominal Dimensions in mm
Revision 5/23/2007 1 www.semtech.com
TClamp0602N
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PROTECTION PRODUCTS Absolute Maximum Rating
Rating Peak Pulse Power (tp = 8/20μs) Peak Pulse Current (tp = 2/10μs) Peak Pulse Current (tp = 8/20μs) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Operating Temperature Storage Temperature Symbol Ppk IPP IPP VESD TJ TSTG Value 2500 120 95 30 30 -55 to +125 -55 to +150 Units Watts A A kV °C °C
Electrical Characteristics (T=25oC)
TClamp0602N Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage.