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WF5027 Dataheets PDF



Part Number WF5027
Manufacturers Nippon Precision Circuits
Logo Nippon Precision Circuits
Description Crystal Oscillator Module ICs
Datasheet WF5027 DatasheetWF5027 Datasheet (PDF)

WF5027 series Crystal Oscillator Module ICs www.datasheet4u.com OVERVIEW The WF5027 series are miniature crystal oscillator module ICs. The oscillator circuit stage has voltage regulator drive, significantly reducing current consumption and crystal current, compared with existing devices, and significantly reducing the oscillator characteristics supply voltage dependency. There are 3 pad layout package options available for optimized mounting, making these devices ideal for miniature crystal osci.

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WF5027 series Crystal Oscillator Module ICs www.datasheet4u.com OVERVIEW The WF5027 series are miniature crystal oscillator module ICs. The oscillator circuit stage has voltage regulator drive, significantly reducing current consumption and crystal current, compared with existing devices, and significantly reducing the oscillator characteristics supply voltage dependency. There are 3 pad layout package options available for optimized mounting, making these devices ideal for miniature crystal oscillators. FEATURES I I I I I Wide range of operating supply voltage: 1.60 to 3.63V Regulated voltage drive oscillator circuit for reduced power consumption and crystal drive current Optimized low crystal drive current oscillation for miniature crystal units 3 pad layout options for mounting • 5027A×, M×, Q× series: for Flip Chip Bonding • 5027B×, N×, R× series: for Wire Bonding (type I) • 5027C×, P×, S× series: for Wire Bonding (type II) Recommended oscillation frequency range For fundamental oscillator • Low frequency version: 20MHz to 60MHz • High frequency version: 60MHz to 100MHz For 3rd overtone oscillator • Low frequency version: 40MHz to 110MHz • High frequency version*1: 110MHz to 180MHz *1: under development I I I I I I I I Multi-stage frequency divider for low-frequency output support: 0.9MHz (min) Frequency divider built-in (for fundamental oscillator) • Selectable by version: fO, fO/2, fO/4, fO/8, fO/16, fO/32, fO/64 −40 to 85°C operating temperature range Standby function • High impedance in standby mode, oscillator stops CMOS output duty level (1/2VDD) 50 ± 5% output duty 15pF output drive capability Wafer form (WF5027××) Chip form (CF5027××) APPLICATIONS I 3.2 × 2.5, 2.5 × 2.0, 2.0 × 1.6 size miniature crystal oscillator modules ORDERING INFORMATION Device WF5027××–4 CF5027××–4 Package Wafer form Chip form SEIKO NPC CORPORATION —1 WF5027 series SERIES CONFIGURATION For Fundamental Oscillator Operating Output drive www.datasheet4u.com supply capability voltage range [mA] [V] PAD layout Recommended oscillation frequency range*1 [MHz] 20 to 60 60 to 100 20 to 60 60 to 100 20 to 60 60 to 100 Version*2 fO output 5027A1 5027AP 5027B1 5027BP 5027C1 5027CP fO/2 output 5027A2 5027AQ 5027B2 5027BQ 5027C2 5027CQ fO/4 output 5027A3 5027AR 5027B3 5027BR 5027C3 5027CR fO/8 output 5027A4 5027AS 5027B4 5027BS 5027C4 5027CS fO/16 output 5027A5 5027AT 5027B5 5027BT 5027C5 5027CT fO/32 output 5027A6 5027AV 5027B6 5027BV 5027C6 5027CV fO/64 output 5027A7 5027AW 5027B7 5027BW 5027C7 5027CW Flip Chip Bonding 1.60 to 3.63 ±4 Wire Bonding Type I Wire Bonding Type II *1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated. *2. Wafer form devices have designation WF5027×× and chip form devices have designation CF5027××. For 3rd Overtone Oscillator Operating Output drive supply capability voltage range [mA] [V] Recommended oscillation frequency range*1 [MHz] and version*2 PAD layout 40 to 50 Flip Chip Bonding 1.60 to 3.63 ±8 Wire Bonding Type I Wire Bonding Type II 5027MA 5027NA 5027PA 50 to 65 5027MB 5027NB 5027PB 65 to 85 5027MC 5027NC 5027PC 85 to 110 5027MD 5027ND 5027PD 110 to 145 145 to 180 (5027QE) (5027RE) (5027SE) (5027QF) (5027RF) (5027SF) *1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated. *2. Wafer form devices have designation WF5027×× and chip form devices have designation CF5027××. Versions in parentheses ( ) are under development. VERSION NAME Device WF5027××–4 Package Wafer form Version name WF5027 Form WF: Wafer form CF: Chip (Die) form −4 Oscillation frequency range, frequency divider function Pad layout type A, M, Q: for Flip Chip Bonding B, N, R: for Wire Bonding (type I) C, P, S: for Wire Bonding (type II) CF5027××–4 Chip form SEIKO NPC CORPORATION —2 WF5027 series PAD LAYOUT (Unit: µm) I www.datasheet4u.com 5027A×, M×, Q× (for Flip Chip Bonding) (750,690) VSS 5 6 1 (0,0) XT X 2 XTN 4 3 Q VDD I 5027B×, N×, R× (for Wire Bonding (type I)) (750,690) Q 5 6 1 (0,0) XTN X 2 XT 4 3 VSS INHN I 5027C×, P×, S× (for Wire Bonding (type II)) (750,690) VDD 5 6 1 (0,0) XT X 2 XTN 4 3 Q VSS Y INHN Y VDD Y INHN Chip size: 0.75 × 0.69mm Chip thickness: 130 ± 15µm PAD size: 90µm Chip base: VSS level Chip size: 0.75 × 0.69mm Chip thickness: 130 ± 15µm PAD size: 90µm Chip base: VSS level Chip size: 0.75 × 0.69mm Chip thickness: 130 ± 15µm PAD size: 90µm Ch.


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