M36L0R7050B0

M36L0R7050T0 M36L0R7050B0 www.datasheet4u.com 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 32 Mbit (2Mb x16) Asynchronous Pseudo SRAM ■ SUPPLY VOLTAGE – VDDF = VDDP = VDDQ = 1.7 to 1.95V – VPPF = 9V for fast program (12V tolerant) ■ ELECTRONIC SIGNATURE – Manufacturer Code: 20h – Device Code (Top Flash Configuration) M36L0R7050T0: 88C4h – Device Code (Bottom Flash Configuration) M36L0R7050B0: 88C5h ■ PACKAGE – Compliant with Lead-Free Soldering Processes – Lead-Free Versions FLASH MEMORY ■ SYNCHRONOUS / ASYNCHRONOUS READ – Synchronous Burst Read mode: 54MHz – Asynchronous Page Read mode – Random Access: 85ns ■ SYNCHRONOUS BURST READ SUSPEND ■ PROGRAMMING TIME – 10µs typical Word program time using Buffer Program ■ MEMORY ORGANIZATION – Multiple Bank Memory Array: 8 Mbit Banks – Parameter Blocks (Top or Bottom location) ■ DUAL OPERATIONS – program/erase in one Bank while read in others – No delay between read and write operations ■ SECURITY – 64 bit unique device number – 2112 bit user programmable OTP Cells ■ Figure 1. Package FBGA TFBGA88 (ZAQ) 8 x 10mm BLOCK LOCKING – All blocks locked at power-up – Any combination of blocks can be locked with zero latency – WPF for Block Lock-Down – Absolute Write Protection with VPPF = VSS ■ COMMON FLASH INTERFACE (CFI) ■ 100,000 PROGRAM/ERASE...