SST29VF020. 29VF020 Datasheet

29VF020 SST29VF020. Datasheet pdf. Equivalent

Part 29VF020
Description SST29VF020
Feature 512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit (x8) Small-Sector Flash SST29SF512 / SST29SF010 / SST29SF020 / S.
Manufacture Silicon Storage Technology
Datasheet
Download 29VF020 Datasheet



29VF020
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit (x8) Small-Sector Flash
SST29SF512 / SST29SF010 / SST29SF020 / SST29SF040
SST29VF512 / SST29VF010 / SST29VF020 / SST29VF040
SST29SF/VF512 / 010 / 020 / 0405.0 & 2.7V 512Kb / 1Mb / 2Mb / 4Mb (x8) Byte-Program, Small Erase Sector flash memories
FEATURES:
Preliminary Specifications
• Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8
• Single Voltage Read and Write Operations
www.datashee5t4.0u.Vc-oomnly for SST29SF512/010/020/040
– 2.7-3.6V for SST29VF512/010/020/040
Superior Reliability
Endurance: 100,000 Cycles (typical)
Greater than 100 years Data Retention
Low Power Consumption:
Active Current: 10 mA (typical)
Standby Current:
30 µA (typical) for SST29SF512/010/020/040
1 µA (typical) for SST29VF512/010/020/040
Sector-Erase Capability
Uniform 128 Byte sectors
Fast Read Access Time:
55 ns
70 ns
Latched Address and Data
Fast Erase and Byte-Program:
Sector-Erase Time: 18 ms (typical)
Chip-Erase Time: 70 ms (typical)
Byte-Program Time: 14 µs (typical)
Chip Rewrite Time:
1 second (typical) for SST29SF/VF512
2 seconds (typical) for SST29SF/VF010
4 seconds (typical) for SST29SF/VF020
8 seconds (typical) for SST29SF/VF040
Automatic Write Timing
Internal VPP Generation
End-of-Write Detection
Toggle Bit
Data# Polling
TTL I/O Compatibility for SST29SFxxx
CMOS I/O Compatibility for SST29VFxxx
JEDEC Standard
Flash EEPROM Pinouts and command sets
Packages Available
32-pin PLCC
32-pin TSOP (8mm x 14mm)
32-pin PDIP
PRODUCT DESCRIPTION
The SST29SF512/010/020/040 and SST29VF512/010/
020/040 are 64K x8 / 128K x8 / 256K x8 / 512K x8 CMOS
Small-Sector Flash (SSF) manufactured with SSTs propri-
etary, high performance CMOS SuperFlash technology.
The split-gate cell design and thick oxide tunneling injector
attain better reliability and manufacturability compared with
alternate approaches. The SST29SFxxx devices write
(Program or Erase) with a 4.5-5.5V power supply. The
SST29VFxxx devices write (Program or Erase) with a 2.7-
3.6V power supply. These devices conform to JEDEC stan-
dard pinouts for x8 memories.
Featuring high performance Byte-Program, the
SST29SFxxx and SST29VFxxx devices provide a maxi-
mum Byte-Program time of 20 µsec. To protect against
inadvertent write, they have on-chip hardware and Soft-
ware Data Protection schemes. Designed, manufactured,
and tested for a wide spectrum of applications, these
devices are offered with a guaranteed endurance of at least
10,000 cycles. Data retention is rated at greater than 100
years.
The SST29SFxxx and SST29VFxxx devices are suited for
applications that require convenient and economical updat-
ing of program, configuration, or data memory. For all sys-
tem applications, they significantly improve performance
and reliability, while lowering power consumption. They
inherently use less energy during Erase and Program than
alternative flash technologies. The total energy consumed
is a function of the applied voltage, current, and time of
application. Since for any given voltage range, the Super-
Flash technology uses less current to program and has a
shorter erase time, the total energy consumed during any
Erase or Program operation is less than alternative flash
technologies. They also improve flexibility while lowering
the cost for program, data, and configuration storage appli-
cations.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Pro-
gram cycles.
To meet high density, surface mount requirements, the
SST29SFxxx and SST29VFxxx devices are offered in 32-
pin PLCC and 32-pin TSOP packages. A 600 mil, 32-pin
PDIP is also offered for SST29SFxxx devices. See Figures
1, 2, and 3 for pinouts.
©2001 Silicon Storage Technology, Inc.
S71160-05-000 5/01
505
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
SSF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.



29VF020
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Small-Sector Flash
SST29SF512 / SST29SF010 / SST29SF020 / SST29SF040
SST29VF512 / SST29VF010 / SST29VF020 / SST29VF040
Preliminary Specifications
Device Operation
Commands are used to initiate the memory operation func-
tions of the device. Commands are written to the device
www.dautassinhgeest4tau.ncdomard microprocessor write sequences. A com-
mand is written by asserting WE# low while keeping CE#
low. The address bus is latched on the falling edge of WE#
or CE#, whichever occurs last. The data bus is latched on
the rising edge of WE# or CE#, whichever occurs first.
Read
The Read operation of the SST29SFxxx and SST29VFxxx
devices are controlled by CE# and OE#, both have to be
low for the system to obtain data from the outputs. CE# is
used for device selection. When CE# is high, the chip is
deselected and only standby power is consumed. OE# is
the output control and is used to gate data from the output
pins. The data bus is in high impedance state when either
CE# or OE# is high. Refer to the Read cycle timing dia-
gram for further details (Figure 4).
Byte-Program Operation
The SST29SFxxx and SST29VFxxx devices are pro-
grammed on a byte-by-byte basis. The Program operation
consists of three steps. The first step is the three-byte-load
sequence for Software Data Protection. The second step is
to load byte address and byte data. During the Byte-Pro-
gram operation, the addresses are latched on the falling
edge of either CE# or WE#, whichever occurs last. The
data is latched on the rising edge of either CE# or WE#,
whichever occurs first. The third step is the internal Pro-
gram operation which is initiated after the rising edge of the
fourth WE# or CE#, whichever occurs first. The Program
operation, once initiated, will be completed, within 20 µs.
See Figures 5 and 6 for WE# and CE# controlled Program
operation timing diagrams and Figure 16 for flowcharts.
During the Program operation, the only valid reads are
Data# Polling and Toggle Bit. During the internal Program
operation, the host is free to perform additional tasks. Any
commands written during the internal Program operation
will be ignored.
Sector-Erase Operation
The Sector-Erase operation allows the system to erase the
device on a sector-by-sector basis. The SST29SFxxx and
SST29VFxxx offer Sector-Erase mode. The sector archi-
tecture is based on uniform sector size of 128 Bytes. The
Sector-Erase operation is initiated by executing a six-byte-
command sequence with Sector-Erase command (20H)
and sector address (SA) in the last bus cycle. The sector
address is latched on the falling edge of the sixth WE#
pulse, while the command (20H) is latched on the rising
edge of the sixth WE# pulse. The internal Erase operation
begins after the sixth WE# pulse. The End-of-Erase opera-
tion can be determined using either Data# Polling or Toggle
Bit methods. See Figure 9 for timing waveforms. Any com-
mands issued during the Sector-Erase operation are
ignored.
Chip-Erase Operation
The SST29SFxxx and SST29VFxxx devices provide a
Chip-Erase operation, which allows the user to erase the
entire memory array to the 1sstate. This is useful when
the entire device must be quickly erased.
The Chip-Erase operation is initiated by executing a six-
byte Software Data Protection command sequence with
Chip-Erase command (10H) with address 555H in the last
byte sequence. The internal Erase operation begins with
the rising edge of the sixth WE# or CE#, whichever occurs
first. During the internal Erase operation, the only valid read
is Toggle Bit or Data# Polling. See Table 4 for the command
sequence, Figure 10 for timing diagram, and Figure 19 for
the flowchart. Any commands written during the Chip-
Erase operation will be ignored.
Write Operation Status Detection
The SST29SFxxx and SST29VFxxx devices provide two
software means to detect the completion of a Write (Pro-
gram or Erase) cycle, in order to optimize the system
write cycle time. The software detection includes two sta-
tus bits: Data# Polling (DQ7) and Toggle Bit (DQ6). The
End-of-Write detection mode is enabled after the rising
edge of WE# which initiates the internal Program or
Erase operation.
The actual completion of the nonvolatile write is asynchro-
nous with the system; therefore, either a Data# Polling or
Toggle Bit read may be simultaneous with the completion
of the Write cycle. If this occurs, the system may possibly
get an erroneous result, i.e., valid data may appear to con-
flict with either DQ7 or DQ6. In order to prevent spurious
rejection, if an erroneous result occurs, the software routine
should include a loop to read the accessed location an
additional two (2) times. If both reads are valid, then the
device has completed the Write cycle, otherwise the rejec-
tion is valid.
©2001 Silicon Storage Technology, Inc.
2
S71160-05-000 5/01 505





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