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PMEG3020DEP Dataheets PDF



Part Number PMEG3020DEP
Manufacturers NXP
Logo NXP
Description 2A Low Vf MEGA Schottky Barrier Rectifier
Datasheet PMEG3020DEP DatasheetPMEG3020DEP Datasheet (PDF)

PMEG3020DEP 2 A low VF MEGA Schottky barrier rectifier Rev. 01 — 21 April 2009 www.datasheet4u.com Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I I I I I I Average forward current: IF(AV) ≤ 2 A Reverse voltage: VR ≤ 30 V Low forward voltage High po.

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PMEG3020DEP 2 A low VF MEGA Schottky barrier rectifier Rev. 01 — 21 April 2009 www.datasheet4u.com Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I I I I I I Average forward current: IF(AV) ≤ 2 A Reverse voltage: VR ≤ 30 V Low forward voltage High power capability due to clip-bond technology AEC-Q101 qualified Small and flat lead SMD plastic package 1.3 Applications I I I I I Low voltage rectification High efficiency DC-to-DC conversion Switch Mode Power Supply (SMPS) Reverse polarity protection Low power consumption applications 1.4 Quick reference data Table 1. Quick reference data Tj = 25 °C unless otherwise specified. Symbol IF(AV) Parameter average forward current Conditions square wave; δ = 0.5; f = 20 kHz Tamb ≤ 80 °C Tsp ≤ 135 °C VR VF IR [1] [1] Min Typ Max Unit - 460 15 2 2 30 520 50 A A V mV µA reverse voltage forward voltage reverse current IF = 2 A VR = 30 V Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. NXP Semiconductors PMEG3020DEP 2 A low VF MEGA Schottky barrier rectifier 2. Pinning information www.datasheet4u.com Table 2. Pin 1 2 Pinning Description cathode anode [1] Simplified outline Graphic symbol 1 2 sym001 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Package Name PMEG3020DEP Description plastic surface-mounted package; 2 leads Version SOD128 Type number 4. Marking Table 4. Marking codes Marking code AH Type number PMEG3020DEP 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF(AV) Parameter reverse voltage average forward current Conditions Tj = 25 °C square wave; δ = 0.5; f = 20 kHz Tamb ≤ 80 °C Tsp ≤ 135 °C IFSM Ptot non-repetitive peak forward current total power dissipation square wave; tp = 8 ms Tamb ≤ 25 °C [2] [1] Min - Max 30 Unit V - 2 2 50 625 1050 2100 A A A mW mW mW [3][4] [3][5] [3][1] PMEG3020DEP_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 21 April 2009 2 of 13 NXP Semiconductors PMEG3020DEP 2 A low VF MEGA Schottky barrier rectifier Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). www.datasheet4u.co m Symbol Parameter junction temperature ambient temperature storage temperature Conditions Min −55 −65 Max 150 +150 +150 Unit °C °C °C Tj Tamb Tstg [1] [2] [3] [4] [5] Device mounted on a ceramic PCB, Al2O3, standard footprint. Tj = 25 °C prior to surge. Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 6. Thermal characteristics Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1][2] [3] [4] [5] Min - Typ - Max 200 120 60 12 Unit K/W K/W K/W K/W Rth(j-sp) [1] [2] [3] [4] [5] [6] thermal resistance from junction to solder point [6] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint. Soldering point of cathode tab. PMEG3020DEP_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 21 April 2009 3 of 13 NXP Semiconductors PMEG3020DEP 2 A low VF MEGA Schottky barrier rectifier www.datasheet4u.com Zth(j-a) (K/W) 102 duty cycle = 1 0.5 0.25 0.1 10 0.02 0.05 0.01 0.75 0.33 0.2 103 006aab374 1 0 10−1 10−3 10−2 10−1 1 10 102 tp (s) 103 FR4 PCB, standard footprint Fig 1. 103 Zth(j-a) (K/W) 102 Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab375 duty cycle = 1 0.5 0.25 0.75 0.33 0.2 0.05 0.02 0.01 10 0.1 1 0 10−1 10−3 10−2 10−1 1 10 102 tp (s) 103 FR4 PCB, mounting pad for cathode 1 cm2 Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMEG3020DEP_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 21 April 2009 4 of 13 NXP Semiconductors PMEG3020DEP 2 A low VF MEGA Schottky barrier rectifier www.datasheet4u.com Zth(j-a) (K/W) 102 duty cycle = 1 0.5 10 0.25 0.1 0.02 1 0 0.75 0.33 0.2 0.05 0.01 103 006aab376 10−1 10−3 10−2 10−1 1 10 102 tp (s) 103 Ceramic PCB, Al2O3, standard footprint F.


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