Document
19-2862; Rev 1; 2/05
750mW Audio Amplifiers with Headphone Amp, Microphone Preamp, and Input Mux
General Description
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Features
♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ 750mW BTL Stereo Speaker Amplifier 65mW Stereo Headphone Amplifier 2.7V to 5.5V Single-Supply Operation Patented Click-and-Pop Suppression Low 0.003% THD+N Low Quiescent Current: 13mA Low-Power Shutdown Mode: 5µA MUTE Function Headphone Sense Input Stereo 2:1 Input Multiplexer Optional 2-Wire, I2C-Compatible, or Parallel Interface ♦ Small 32-Pin Thin QFN (5mm ✕ 5mm ✕ 0.8mm) Package
MAX9765/MAX9766/MAX9767
The MAX9765/MAX9766/MAX9767 family combines speaker, headphone, and microphone amplifiers, all in a small thin QFN package. The MAX9765 is targeted at stereo speaker playback applications and includes a stereo bridge-tied load (BTL) speaker amp, stereo headphone amp, single-ended output mic amp, input MUX, and I 2C control. The MAX9766 is targeted at mono speaker playback applications and includes a mono BTL speaker amp, stereo headphone amp, differential output mic amp, input MUX, and I2C control. The MAX9767 is targeted at applications that do not require a headphone amp and includes a stereo BTL speaker amp, differential output mic amp, and parallel control. These devices operate from a single 2.7V to 5.5V supply. A high 95dB PSRR allows these devices to operate from noisy supplies without additional power conditioning. An ultra-low 0.003% THD+N ensures clean, low distortion amplification of the audio signal. Patented click-and-pop suppression eliminates audible transients on power and shutdown cycles. In speaker mode, the amplifiers can deliver up to 750mW of continuous average power into a 4Ω load. In headphone mode, the amplifier can deliver up to 65mW of continuous average power into a 16Ω load. The gain of the amplifiers is externally set, allowing maximum flexibility in optimizing output levels for a given load. The MAX9765/MAX9766 also feature a 2:1 input multiplexer, allowing multiple audio sources to be selected. The various functions are controlled by either an I 2Ccompatible (MAX9765/MAX9766) or simple parallel control interface (MAX9767). All devices include two low-noise microphone preamps, a differential amp for internal microphones, and a single-ended amplifier for additional external microphones. A microphone bias output is provided, reducing external component count. The MAX9765/MAX9766/MAX9767 are available in a thermally efficient 32-pin thin QFN package (5mm ✕ 5mm ✕ 0.8mm). All devices have short-circuit and thermal-overload protection (OVP) and are specified over the extended -40°C to +85°C temperature range.
Ordering Information
PART MAX9765ETJ MAX9766ETJ MAX9767ETJ TEMP RANGE -40oC to +85oC -40oC to +85oC -40oC to +85oC PIN-PACKAGE 32 Thin QFN-EP* 32 Thin QFN-EP* 32 Thin QFN-EP*
*EP = Exposed paddle. Pin Configurations and Functional Diagrams appear at end of data sheet.
Simplified Diagram
MUX INL1 INL2 MUX INR1 INR2 SPKR RIGHT DEVICE CONTROL SPKR LEFT HEADPHONE
Applications
PDA Audio Systems Tablet PCs Cell Phones
Purchase of I2C components from Maxim Integrated Products, Inc., or one of its sublicensed Associated Companies, conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification defined by Philips.
CONTROL
Notebooks Digital Cameras
MICINMICIN+ AUXIN MICBIAS BIAS MUX MICOUT
MAX9765
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750mW Audio Amplifiers with Headphone Amp, Microphone Preamp, and Input Mux
MAX9765/MAX9766/MAX9767
ABSOLUTE MAXIMUM RATINGS
DD
www.datasheet4u.com V to GND ...........................................................................+6V
SVDD to GND .........................................................................+6V SVDD to VDD .........................................................................-0.3V PVDD to VDD .......................................................................±0.3V PGND to GND.....................................................................±0.3V All Other Pins to GND.................................-0.3V to (VDD + 0.3V) Output Short-Circuit Duration (to VDD or GND)..........Continuous Continuous Input Current (into any pin except power-supply and output pins) ...............................................................±20mA
Continuous Power Dissipation (TA = +70°C) 32-Pin Thin QFN (derate 26.3mW/°C above +70°C) ...2105.3mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond .