HWI322522

www.DataSheet4U.com MOLDED WIREWOUND CHIP INDUCTORS HWI322522 SERIES 1. PART NO. EXPRESSION : HW I 3 2 2 5 2 2 - 1 R 0 K F (a) (b) (c) (d) (e) (a) Series code (b) Dimension code (c) Inductance code : 1R0 = 1.00uH (d) Tolerance code : K = ±10%, M = ±20% (e) F : Lead Free 2. CONFIGURATION & DIMENSIONS : 3R3 A I G I C F F E B PCB Pattern Unit:m/m A 3.2±0.4 B 2.5±0.2 C 2.2±0.2 E 1.0±0.3 F 0.6±0.2 G 1.8 Ref. H 1.4 Ref. I 1.0 Ref. 3. SCHEMATIC : 4. MATERIALS : d (a) Core : DR Ferrite Core (b) Wire : Enamelled Copper Wire a (c) Terminal : Tinned Copper Plate (d) Capsulate : Epoxy Novolac Molding Compound c b NOTE : Specifications subject to change without notice. Please check our website for latest information. H 26.02.2009 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 www.DataSheet4U.com MOLDED WIREWOUND CHIP INDUCTORS HWI322522 SERIES 5. GENERAL SPECIFICATION : a) Temp. rise : 20°C Max. b) Ambient temp. : 100°C Max. c) Storage temp. : -40°C to +125°C d) Operating temp. : -40°C to +125°C e) Terminal strength : 0.5Kg Min. f) Rated current : Current cause inductance drop within 10% g) Resistance to solder heat : 260°C for 10secs h) Resistance to solvent : Per MIL-STD-202F 6. CHARACTERISTICS CURVES : Peak Temp : 250°C Max. Max time above 230°C : 40sec Max. Max time above 200°C : 70sec Max. Temperature Rising Area 2~4°C/sec 250 200 150 100 50 0 50 100 150 Time (seconds) 200 250 Preheat Area 150~180°C / 90~150 sec Reflow Area 2~4°C/sec Cooling Area 3~5°C/sec...