Document
19-4166; Rev 1; 4/09
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PMIC with Integrated Chargers and Smart Power Selector in a 4mm x 4mm TQFN
General Description
The MAX8819_ is a complete power solution for MP3 players and other handheld applications. The IC includes a battery charger, step-down converters, and WLED power. It features an input current-limit switch to power the IC from an AC-to-DC adapter or USB port, a 1-cell lithium ion (Li+) or lithium polymer (Li-Poly) charger, three step-down converters, and a step-up converter with serial step dimming for powering two to six white LEDs. All power switches for charging and switching the system load between battery and external power are included on-chip. No external MOSFETs are required. The MAX8819C offers a sequenced power-up/powerdown of OUT1, OUT2, and then OUT3. Maxim’s Smart Power Selector™ makes the best use of AC-to-DC adapter power or limited USB power. Battery charge current and input current limit are independently set. Input power not used by the system charges the battery. Charge current is resistor programmable and the input current limit can be selected as 100mA, 500mA, or 1A. Automatic input selection switches the system load from battery to external power. In addition, on-chip thermal limiting reduces the battery charge rate to prevent charger overheating. o o o o
Features
Smart Power Selector Operates with No Battery Present USB/AC Adapter One-Cell Li+ Charger Three 2MHz Step-Down Converters 95% Peak Efficiency 100% Duty Cycle ±3% Output Accuracy over Load/Line/ Temperature 2 to 6 Series WLED Driver with Dimming Control Active-Low REG1 Reset Output Short-Circuit/Thermal-Overload/Input Undervoltage/Overvoltage Protection Power-Up/Down Sequencing (MAX8819C) Total Solution Size: Less Than 90mm2
MAX8819A/MAX8819B/MAX8819C
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Typical Operating Circuit
USB/AC-TO-DC ADAPTER DC DLIM1 DLIM2 BAT + ENABLE SYSTEM ENABLE CHARGER ENABLE BACKLIGHT SYS EN123 CEN EN4 LX4 OVP4 LX2 LX1 OUT1 I/O Li+/Li-Poly BATTERY SYS
Applications
MP3 Players Portable GPS Devices Low-Power Handheld Products Cellular Telephones Digital Cameras Handheld Instrumentation PDAs
MAX8819_
Ordering Information
PART MAX8819AETI+ MAX8819BETI+ MAX8819CETI+ TEMP RANGE PINPACKAGE SYS VOLTAGE (V) 4.35 5.3 4.35
FB4 LX3
OUT2 MEMORY
OUT3 CORE
-40°C to +85°C 28 TQFN-EP* -40°C to +85°C 28 TQFN-EP* -40°C to +85°C 28 TQFN-EP*
CISET CHG RST1 CHG RST1
+Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad.
Smart Power Selector is a trademark of Maxim Integrated Products, Inc.
Pin Configuration appears at end of data sheet.
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________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
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PMIC with Integrated Chargers and Smart Power Selector in a 4mm x 4mm TQFN MAX8819A/MAX8819B/MAX8819C
ABSOLUTE MAXIMUM RATINGS
DC, SYS, BAT, CISET, DLIM1, DLIM2, EN123 CEN, EN4, CHG, RST1, FB1, FB2, FB3 to GND....-0.3V to +6V PV2 to GND ...............................................-0.3V to (VSYS + 0.3V) PV13 to SYS...........................................................-0.3V to +0.3V PG1, PG2, PG3, PG4 to GND................................-0.3V to +0.3V COMP4, FB4 to GND ................................-0.3V to (VSYS + 0.3V) LX4 to PG4 .............................................................-0.3V to +33V OVP4 to GND .........................................................-0.3V to +33V LX1, LX2, LX3 Continuous Current (Note 1) .........................1.5A LX4 Current ................................................................750mARMS Output Short-Circuit Duration.....................................Continuous Continuous Power Dissipation (TA = +70°C) 28-Pin Thin QFN Single-Layer Board (derate 20.8mW/°C above +70°C)...........................................................1666.7mW 28-Pin Thin QFN Multilayer Board (derate 28.6mW/°C above +70°C)...........................................................2285.7mW Junction-to-Case Thermal Resistance (θJC) (Note 2) 28-Lead Thin QFN...........................................................3°C/W Operating Temperature Range ...........................-40°C to +85°C Junction Temperature........................................-40°C to +125°C Storage Temperature.........................................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C
Note 1: LX1, LX2, LX3 have clamp diodes to their respective PG_ and PV_. Applications that forward bias these diodes must take care not to exceed the package power dissipation limits. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial.
Stresses beyo.