SC7777T

KA, SC www.DataSheet4U.com hybrid IC EU NEW features Adjustment processes are decreased by function and ratio trimmings High density mounting by bonding (COB) Various types of package are available High reliability achieved by KOA’s original thick film technology Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production EW ordering information N New Part # KA Product Code KA: Hybrid IC SC: Non-Noble 7777 KOA Ref. Number D Terminal Surface Material D: SnAgCu T: Sn Component - KA/CB Series Substrate Materials Item AI2O3 Alumina Glass epoxy Item Conductor resistance Heat shock RuO2 Item COB BGA QFP Chip Package SIP DIP, SOP ZIP Over Coating Epoxy metamorphic phenol Epoxy Printing Mounting o o x o Ag-Pd Ag-Pt 18mΩ/ /15µmµ 5mΩ/ /10µm -55°C~+125°C 300 Cycles -55°C~+125°C 500 Cycles -6 5Ω~10MΩ ±100x10 /K Specifications Au Wire, AI Wire 0.8mm Pitch~ 0.4mm Pitch~ 0.6mm x 0.3mm (0.4mm x 0.2mm)~ Lead Pitch 1.8mm, 2.0mm, 2.5mm, 2.54mm 1.27mm, 1.8mm, 2.54mm 2.54mm Color Black Black Bonding o o Cu 2mΩ/ /20µm -55°C~+125°C 500 Cycles 10Ω~1MΩ ±100x10-6/k Conductors, Resistors Mounting Package, Outside Terminals Over Coating, Plating o= Available x= Not available UL Standard 94 V0 Approved 94 V1 Approved Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications ...