Step-Down Converters. MAX8884Z Datasheet

MAX8884Z Datasheet PDF, Equivalent


Part Number

MAX8884Z

Description

700mA DC-DC Step-Down Converters

Manufacture

Maxim Integrated Products

Total Page 17 Pages
PDF Download
Download MAX8884Z Datasheet PDF


MAX8884Z Datasheet
19-4418; Rev 1; 1/10
EVAALVUAAILTAIOBNLEKIT
700mA DC-DC Step-Down Converters
with Dual 300mA LDO in 2mm x 2mm CSP
General Description
The MAX8884Y/MAX8884Z step-down converters with
dual low-dropout (LDO) linear regulators are intended to
power low-voltage microprocessors, DSPs, camera and
Wi-Fi modules, or other point of load applications in
portable devices. These ICs feature high efficiency with
small external component size. The step-down converter
output voltage is pin selectable between 1.2V and 1.8V,
and provides guaranteed output current of 700mA. The
2/4MHz hysteretic-PWM control scheme allows for tiny
external components and reduces no-load operating
current to 50µA. Two low quiescent current, low-noise
LDOs operate down to 2.7V supply voltage. Two switch-
ing frequency options are available—MAX8884Y (2MHz)
and MAX8884Z (4MHz)—allowing optimization for small-
est solution size or highest efficiency. Fast switching
allows the use of small ceramic 2.2µF input and output
capacitors while maintaining low ripple voltage. The
MAX8884Y/MAX8884Z have individual enables for each
output, maximizing flexibility.
The MAX8884Y/MAX8884Z are available in a 16-bump,
2mm x 2mm CSP package (0.7mm max height).
Applications
Cell Phones/Smartphones
PDA and Palmtop Computers
Portable MP3 and DVD Players
Digital Cameras, Camcorders
PCMCIA Cards
Handheld Instruments
Typical Operating Circuit
BATT
2.7V TO 5.5V
2.2µF
BUCK ON/OFF
BUCK/LDO1 VOLTAGE
SELECTION
LDO1 ON/OFF
LDO2 ON/OFF
BATT
2.7V TO 5.5V
IN1A FB
IN1B
LX
MAX8884Y
BUCK_EN MAX8884Z
PGND
REFBP
SEL
LDO1_EN
LDO2_EN
AGND
LDO1
BUCK
1.2V/1.8V
2.2µH
2.2µF
VLDO1
UP TO 300mA
IN2
LDO2
VLDO2
UP TO 300mA
Features
o Step-Down Converter
Pin-Selectable Output Voltage (1.2V/1.8V)
2MHz or 4MHz Switching Frequency
Low-Output Voltage Ripple
700mA Output Drive Capability
Simple Logic ON/OFF Control
Tiny External Components
o Low-Noise LDOs
2 x 300mA LDO
Pin-Selectable Output Voltage (LDO1)
Low 26µVRMS (typ) Output Noise
High 65dB (typ) PSRR
Simple Logic ON/OFF Control
o Low 0.1µA Shutdown Current
o 2.7V to 5.5V Supply Voltage Range
o Thermal Shutdown
o Tiny, 2mm x 2mm x 0.65mm CSP Package (4x4 Grid)
Ordering Information
PART
PIN-PACKAGE
SWITCHING
FREQUENCY
MAX8884YEREKE+T 16 CSP
2MHz
MAX8884ZEREKE+T 16 CSP
4MHz
Note: All devices are specified over the -40°C to +85°C operat-
ing temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
Typical Application Circuit appears at end of data sheet.
Pin Configuration
TOP VIEW
(BUMPS ON BOTTOM)
A1
REFBP
B1
LDO2
C1
IN2
D1
LDO1
MAX8884Y
MAX8884Z
A2 A3
AGND
NC1
B2 B3
BUCK_EN LDO2_EN
C2 C3
SEL IN1B
D2
LDO1_EN
D3
NC2
CSP
A4
PGND
B4
LX
C4
IN1A
D4
FB
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

MAX8884Z Datasheet
700mA DC-DC Step-Down Converters
with Dual 300mA LDO in 2mm x 2mm CSP
ABSOLUTE MAXIMUM RATINGS
IN1A, IN1B, IN2, REFBP to AGND ........................-0.3V to +6.0V
FB to PGND ...........................................................-0.3V to +6.0V
SEL, BUCK_EN to AGND...............-0.3V to (VIN1A/VIN1B + 0.3V)
LDO1, LDO2, LDO1_EN, LDO2_EN
to AGND.................................................-0.3V to (VIN2 + 0.3V)
IN2 to IN1A, IN1B ..................................................-0.3V to +0.3V
AGND to PGND .....................................................-0.3V to +0.3V
IN1A, IN1B, LX Current .....................................................1ARMS
Continuous Power Dissipation (TA = +70°C)
16-Bump CSP (derate 12.5mW/°C above +70°C) ..............1W
Operating Temperature .......................................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature*.........................................................+260°C
*These ICs are constructed using a unique set of packaging techniques imposing a limit on the thermal profile used during board level
solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification,
JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN1A = VIN1B = VIN2 = VLDO1_EN = VLDO2_EN = VBUCK_EN = 3.6V. TA = -40°C to +85°C, typical values are at TA = +25°C, unless
otherwise noted.) (Note 1)
PARAMETER
INPUT SUPPLY
Input Voltage
Input Undervoltage Threshold
Shutdown Supply Current
No-Load Supply Current
THERMAL PROTECTION
Thermal Shutdown
LOGIC CONTROL
Logic Input-High Voltage
(BUCK_EN, SEL, LDO1_EN,
LDO2_EN)
CONDITIONS
VIN1A, VIN1B, VIN2
VIN1A, VIN1B, VIN2 rising, 180mV typical hysteresis
VBUCK_EN = VLDO1_EN =
VLDO2_EN = 0
TA = +25°C
TA = +85°C
VBUCK_EN = 0, ILDO1 = ILDO2 = 0A
VLDO1_EN = VLDO2_EN = 0, IBUCK = 0A, no switching
TA rising, 20°C typical hysteresis
2.7V  VIN1A = VIN1B = VIN2  5.5V
MIN TYP MAX UNITS
2.7
2.52
2.63
0.1
0.1
140
50
5.5
2.70
4
230
80
V
V
µA
µA
µA
+160
°C
1.3 V
Logic Input-Low Voltage
(BUCK_EN, SEL, LDO1_EN,
LDO2_EN)
Logic Input Current (BUCK_EN,
SEL, LDO1_EN, LDO2_EN)
FB
Buck Converter Output Voltage
FB Leakage Current
LX
On-Resistance
2.7V  VIN1A = VIN1B = VIN2  5.5V
VIL = 0 or VIH = VIN1A = 5.5V
TA = +25°C
TA = +85°C
SEL = AGND, IBUCK = 0A
VSEL = VIN1A, IBUCK = 0A
VIN1A = VIN1B = VIN2 = 5.5V,
VFB = 0
TA = +25°C
TA = +85°C
p-channel MOSFET switch, ILX = -40mA
n-channel MOSFET rectifier, ILX = 40mA
0.4
0.01 1
0.1
1.18 1.22 1.24
1.78 1.80 1.85
0.01 1
1
0.18 0.30
0.15 0.25
V
µA
V
V
µA

2 _______________________________________________________________________________________


Features Datasheet pdf 19-4418; Rev 0; 4/09 www.DataSheet4U.co m 700mA DC-DC Step-Down Converters wit h Dual 300mA LDO in 2mm x 2mm CSP Gener al Description The MAX8884Y/MAX8884Z st ep-down converters with dual low-dropou t (LDO) linear regulators are intended to power low-voltage microprocessors, D SPs, camera and Wi-Fi modules, or other point of load applications in portable devices. These ICs feature high effici ency with small external component size . The step-down converter output voltag e is pin selectable between 1.2V and 1. 8V, and provides guaranteed output curr ent of 700mA. The 2/4MHz hysteretic-PWM control scheme allows for tiny externa l components and reduces no-load operat ing current to 50μA. Two low quiescent current, low-noise LDOs operate down t o 2.7V supply voltage. Two switching fr equency options are available—MAX8884 Y (2MHz) and MAX8884Z (4MHz)—allowing optimization for smallest solution siz e or highest efficiency. Fast switching allows the use of small ceramic 2.2μF input and output capacitors w.
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