DatasheetsPDF.com

CPL-WB-00C2 Dataheets PDF



Part Number CPL-WB-00C2
Manufacturers ST Microelectronics
Logo ST Microelectronics
Description EMI Filtering & Signal Conditioning
Datasheet CPL-WB-00C2 DatasheetCPL-WB-00C2 Datasheet (PDF)

www.DataSheet4U.com CPL-WB-00C2 Wide band directional coupler with ISO port Features ■ ■ ■ ■ ■ ■ ■ ■ 50 Ω nominal input / output impedance Wide operating frequency range (824 MHz to 2170 MHz) Low Insertion Loss (< 0.2 dB) 34 dB typical coupling factor High directivity (typical 25 dB) High ESD robustness (IEC 61000-4-2 Level 4) Flip-Chip package Small footprint: 1700 x 1200 µm 3 2 1 RFIN Figure 1. Pin configuration (top view) Benefits ■ ■ ■ ■ Very low profile (< 690 µm thickness) Lead-free .

  CPL-WB-00C2   CPL-WB-00C2


Document
www.DataSheet4U.com CPL-WB-00C2 Wide band directional coupler with ISO port Features ■ ■ ■ ■ ■ ■ ■ ■ 50 Ω nominal input / output impedance Wide operating frequency range (824 MHz to 2170 MHz) Low Insertion Loss (< 0.2 dB) 34 dB typical coupling factor High directivity (typical 25 dB) High ESD robustness (IEC 61000-4-2 Level 4) Flip-Chip package Small footprint: 1700 x 1200 µm 3 2 1 RFIN Figure 1. Pin configuration (top view) Benefits ■ ■ ■ ■ Very low profile (< 690 µm thickness) Lead-free package High RF performance RF module size reduction RFOUT GND A ATN. ATN. B ISO GND CPLD Applications ■ ■ ■ Quad band power amplifier module Quad band front end module GSM / WCDMA mobile phone Description The CPL-WB-00 is a wide band directional coupler designed to measure RF antenna output power in GSM / WCDMA applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS, WCDMA Band I) with less than 0.2 dB insertion losses in the transmit bandwidth (824 MHz to 1980 MHz). The CPL-WB has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel. October 2008 Rev 1 1/8 www.st.com 8 www.DataSheet4U.com Characteristics CPL-WB-00C2 1 Table 1. Symbol PIN Characteristics Absolute maximum rating (limiting values) Value Parameter Min Input Power RFIN ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots with both polarities and each condition, cumulative method) RFIN, RFOUT, air discharge RFIN, RFOUT, contact discharge Typ Max 35 dBm Unit VESD (IEC) ±15 ±8 2 100 500 -30 +85 kV kV kV V V ºC VESD (HBM) Human body model, JESD22-A114-B, All I/O VESD (MM) Machine model, JESD22-A115-A, All I/O VESD (CDM) Charge device model, JESD22-C101-C, All I/O TOP Operating temperature Table 2. Symbol ZOUT ZIN ZCPLD ZOUT Electrical characteristics (Tamb = 25 °C) - impedances Value Parameter Min Nominal output impedance Nominal input impedance Nominal coupling impedance Nominal ISO impedance Typ 50 50 50 50 Max Ω Ω Ω Ω Unit Table 3. Symbol TOP f IL RL CPLD Electrical characteristics (Tamb = 25 °C) - RF Performance Value Parameter Operating temperature Frequency range (bandwidth) Insertion loss in bandwidth Return loss in bandwidth Coupling factor (including attenuator) Coupling ripple in individual band Coupler directivity From 824 MHz to 2170 MHz From 824 MHz to 2170 MHz From 824 MHz to 915 MHz From 1710 MHz to 1980 MHz (824 to 849 MHz) (880 to 915 MHz) (1710 to 1785 MHz) (1850 to 1910 MHz)(1920 to 1980 MHz) From 824 MHz to 1980 MHz 20 25 15 35 28 39 33 0.5 Test condition Min -30 824 0.1 Typ Max +85 1980 0.2 °C MHz dB dB dB dB dB dB Unit Ripple DIR 2/8 www.DataSheet4U.com CPL-WB-00C2 Characteristics 1.1 RF measurement (on reference evaluation board) Measurements done on reference evaluation board under 50 Ω, de-embedding at CPL00 bumps. Figure 2. Insertion loss -0.0 -0.05 -0.1 -0.15 -0.2 -0.25 F (MHz) -0.3 824 959 1093 1228 1362 1497 1632 1766 1901 2035 2170 dB Figure 3. Coupling and isolation -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 824 F (MHz) 959 1093 1228 1362 1497 1632 1766 1901 2035 2170 dB Figure 4. Directivity 40 38 36 34 32 30 28 26 24 22 20 824 F (MHz) 959 1093 1228 1362 1497 1632 1766 1901 2035 2170 3/8 www.DataSheet4U.com Reference evaluation board CPL-WB-00C2 2 Reference evaluation board Figure 5. CPW lines (W = 850 µm with gap to gnd = 260 µm) on top layer + GND on bottom layer ● ● ● ● ● Material: 2 layers FR4 with solder mask on top and bottom layer Substrate thickness: 0.8 mm Line lengths: 10.2 mm Extension values on short line measurement: 102 ps Through insertion loss: 0.20 dB @ 1 GHz , 0.24 dB@ 2 GHz 4/8 www.DataSheet4U.com CPL-WB-00C2 Package information 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 6. Package dimensions 670 µm 650 µm 1.200 mm ± 50 µm Figure 7. Footprint 1.700 mm ± 50µm 500 µm Figure 8. Marking Copper pad Diameter: 250 µm recommended, 300 µm max Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter x x z y ww 5/8 www.DataSheet4U.com Package information Figure 9. Flip Chip tape and reel specifications Dot identifying Pin A1 location 4 ± 0.1 Ø 1.5 ± 0.1 CPL-WB-00C2 1.75 ± 0.1 3.5 ± 0.1 0.73 ± 0.05 All dimensions in mm 8 ± 0.3 ST E xxx yww ST E xxx yww ST E xxx yww 4 ± 0.1 User direction of u.


CPL-WB-01C2 CPL-WB-00C2 HMC-XTB110


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)