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CPL-WB-00C2
Wide band directional coupler with ISO port
Features
■ ■ ■ ■ ■ ■ ■ ■
50 Ω nominal input / output impedance Wide operating frequency range (824 MHz to 2170 MHz) Low Insertion Loss (< 0.2 dB) 34 dB typical coupling factor High directivity (typical 25 dB) High ESD robustness (IEC 61000-4-2 Level 4) Flip-Chip package Small footprint: 1700 x 1200 µm
3 2 1
RFIN
Figure 1.
Pin configuration (top view)
Benefits
■ ■ ■ ■
Very low profile (< 690 µm thickness) Lead-free package High RF performance RF module size reduction
RFOUT GND
A
ATN. ATN.
B
ISO GND CPLD
Applications
■ ■ ■
Quad band power amplifier module Quad band front end module GSM / WCDMA mobile phone
Description
The CPL-WB-00 is a wide band directional coupler designed to measure RF antenna output power in GSM / WCDMA applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS, WCDMA Band I) with less than 0.2 dB insertion losses in the transmit bandwidth (824 MHz to 1980 MHz). The CPL-WB has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel.
October 2008
Rev 1
1/8
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Characteristics
CPL-WB-00C2
1
Table 1.
Symbol PIN
Characteristics
Absolute maximum rating (limiting values) Value Parameter Min Input Power RFIN ESD ratings IEC 61000-4-2 (C = 150 pF, R = 330 Ω, 10 shots with both polarities and each condition, cumulative method) RFIN, RFOUT, air discharge RFIN, RFOUT, contact discharge Typ Max 35 dBm Unit
VESD (IEC)
±15 ±8 2 100 500 -30 +85
kV kV kV V V ºC
VESD (HBM) Human body model, JESD22-A114-B, All I/O VESD (MM) Machine model, JESD22-A115-A, All I/O
VESD (CDM) Charge device model, JESD22-C101-C, All I/O TOP Operating temperature
Table 2.
Symbol ZOUT ZIN ZCPLD ZOUT
Electrical characteristics (Tamb = 25 °C) - impedances
Value Parameter Min Nominal output impedance Nominal input impedance Nominal coupling impedance Nominal ISO impedance Typ 50 50 50 50 Max Ω Ω Ω Ω Unit
Table 3.
Symbol TOP f IL RL CPLD
Electrical characteristics (Tamb = 25 °C) - RF Performance
Value Parameter Operating temperature Frequency range (bandwidth) Insertion loss in bandwidth Return loss in bandwidth Coupling factor (including attenuator) Coupling ripple in individual band Coupler directivity From 824 MHz to 2170 MHz From 824 MHz to 2170 MHz From 824 MHz to 915 MHz From 1710 MHz to 1980 MHz (824 to 849 MHz) (880 to 915 MHz) (1710 to 1785 MHz) (1850 to 1910 MHz)(1920 to 1980 MHz) From 824 MHz to 1980 MHz 20 25 15 35 28 39 33 0.5 Test condition Min -30 824 0.1 Typ Max +85 1980 0.2 °C MHz dB dB dB dB dB dB Unit
Ripple DIR
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CPL-WB-00C2
Characteristics
1.1
RF measurement (on reference evaluation board)
Measurements done on reference evaluation board under 50 Ω, de-embedding at CPL00 bumps. Figure 2. Insertion loss
-0.0 -0.05 -0.1 -0.15 -0.2 -0.25 F (MHz) -0.3 824 959 1093 1228 1362 1497 1632 1766 1901 2035 2170
dB
Figure 3.
Coupling and isolation
-20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 824 F (MHz) 959 1093 1228 1362 1497 1632 1766 1901 2035 2170 dB
Figure 4.
Directivity
40 38 36 34 32 30 28 26 24 22 20 824 F (MHz) 959 1093 1228 1362 1497 1632 1766 1901 2035 2170
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Reference evaluation board
CPL-WB-00C2
2
Reference evaluation board
Figure 5. CPW lines (W = 850 µm with gap to gnd = 260 µm) on top layer + GND on bottom layer
● ● ● ● ●
Material: 2 layers FR4 with solder mask on top and bottom layer Substrate thickness: 0.8 mm Line lengths: 10.2 mm Extension values on short line measurement: 102 ps Through insertion loss: 0.20 dB @ 1 GHz , 0.24 dB@ 2 GHz
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CPL-WB-00C2
Package information
3
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 6. Package dimensions
670 µm 650 µm
1.200 mm ± 50 µm
Figure 7.
Footprint
1.700 mm ± 50µm
500 µm
Figure 8.
Marking
Copper pad Diameter: 250 µm recommended, 300 µm max
Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week)
E
Solder stencil opening: 330 µm
Solder mask opening recommendation: 340 µm min for 300 µm copper pad diameter
x x z y ww
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Package information Figure 9. Flip Chip tape and reel specifications
Dot identifying Pin A1 location 4 ± 0.1 Ø 1.5 ± 0.1
CPL-WB-00C2
1.75 ± 0.1 3.5 ± 0.1
0.73 ± 0.05
All dimensions in mm
8 ± 0.3
ST E
xxx yww
ST E
xxx yww
ST E
xxx yww
4 ± 0.1
User direction of u.