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NKG245P Dataheets PDF



Part Number NKG245P
Manufacturers Stanley Electric
Logo Stanley Electric
Description LEDs
Datasheet NKG245P DatasheetNKG245P Datasheet (PDF)

TABLE OF CONTENTS www.DataSheet4U.com Description of Terminology…………………………………………………………………………………2 Structural Drawing …………………………………………………………………………………………2 Reliability Test and Measuring Method …………………………………………………………………2 Handling Precautions ………………………………………………………………………………………3 Super Bright LED Light Bar Module Description of Part Number …………………………………………………………………………4 Characteristics by Color ………………………………………………………………………………4 LED Light Bar Module Product Line ………………………………………………………………4-7 Super Bright LED.

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TABLE OF CONTENTS www.DataSheet4U.com Description of Terminology…………………………………………………………………………………2 Structural Drawing …………………………………………………………………………………………2 Reliability Test and Measuring Method …………………………………………………………………2 Handling Precautions ………………………………………………………………………………………3 Super Bright LED Light Bar Module Description of Part Number …………………………………………………………………………4 Characteristics by Color ………………………………………………………………………………4 LED Light Bar Module Product Line ………………………………………………………………4-7 Super Bright LED Numeric Display (Seven Segment Display) Description of Part Number ………………………………………………………………………………8 Characteristics by Color …………………………………………………………………………………8 7.5mm Type …………………………………………………………………………………………………9 10.0mm Type ……………………………………………………………………………………………10-12 15.0mm Type ………………………………………………………………………………………………13 25.0mm Type ………………………………………………………………………………………………14 Bi-Color LED Numeric Display…………………………………………………………………………………15 Alpha Numeric LED Display ………………………………………………………………………………16 Index by Part Number …………………………………………………………………………………17-19 1 DESCRIPTION OF TERMINOLOGY www.DataSheet4U.com ITEMS SYMBOLS (Pd) (IF) (IFM) (∆IF) (VF) (IR) (IV) (λp) (∆λ) DEFINITION Power dissipated by forward current and forward voltage Current from anode to cathode Forward peak current driven during pulse lighting Derating over 25°C ambient temperature Voltage drop when forward current goes from anode to cathode Leakage current when bias voltage is applied from cathode to anode Flux in lumens per unit of solid angle on optical axis Wavelength at which radiant intensity becomes greatest Wavelength range in which radiant intensity becomes more than 50% of its peak value UNIT (mW) (mA) (mA) (mA/°C) (V) (µA) (mcd) (nm) (nm) Absolute Max. Ratings Electro-optical characteristics Power dissipation Forward current Peak forward current Current derating Forward voltage Reverse current Luminous intensity Peak wavelength Spectral line half width RELIABILITY TEST AND MEASURING METHOD ■ Items to be Guaranteed for LEDs TEST ITEM Operating Endurance Test STANDARDS TEST CONDITION Ta=25°C, IF=Maximum Rated Current, t=1000 Hrs. 260+5°C, 10+1sec., 3mm from package base -30°C (30 min) to normal temperature (15 min) to +100°C (30 min) To normal temperature (15 min) 5 cycles Ta=60+2°C, RH=90+5%, t=1000Hr Ta=100+2°C, t=1000Hr Ta=30+2°C, t=1000Hr *1kg/10 sec. one time (thin lead: 0.5kg) 10G, 100 to 2000Hz sweep for 20 min., 2 hours for directions X, Y and Z SAMPLE SIZE 25 25 25 25 25 25 10 10 JIS C 7035 Added documents JIS C 7021 Resistance to Soldering Heat A-1 JIS C 7021 Temperature Cycling A-4 JIS C 7021 Humidity (Steady State) B-11 JIS C 7021 High Temperature (Storage) B-10 JIS C 7021 Low Temperature (Storage) A-12 JIS C 7021 Lead Tension A-11 JIS C 7021 Vibration Fatigue A-10 ■ Measuring Method Luminous Intensity (Iv) Detector 7° 100mm (0.01sr) Dark room ■ Structural Drawing for Numeric Display Epoxy resin LED chip Lamp house LED A Constant Current Power Supply Lead frame 2 HANDLING PRECAUTIONS www.DataSheet4U.com ■ Soldering Conditions Please refer to each product to see if it’s compatible with lead-free soldering. Conventional Soldering Conditions SOLDERING IRON DIP SOLDERING Pre-heat: 80°C Max. / 60 sec. Max. (Resin surface temperature) Bath Temperature: 260°C Max. Dipping Time: 5 sec. Max. Position: At least 3.0mm away from resin body REFLOW SOLDERING Iron Tip Temperature: 300°C Max. (30W Max.) Soldering Time: 3 Seconds Max. Location: At least 3.0mm away from resin Not recommended Lead-Free Soldering Conditions SOLDERING IRON Iron Tip Temperature: 400°C Max. Soldering Iron: 30W Max. Soldering Time: 3 Seconds Max. Position: At least 2.0mm away from resin DIP SOLDERING Pre-heat: 100°C Max. / 60 seconds Max. (Resin surface temperature) Bath Temperature: 265°C Max. Dipping time: 5 sec. Max. Position: At least 2.0mm away from resin body REFLOW SOLDERING Not recommended ■ Cleaning Residual solder of flux left on the LED housing could reduce intensity and could affect the optical characteristics. Excess flux can be removed by the following chemical method: 1. Cleaning solvents (dipping time: 3 minutes maximum at normal temperature) • Ethyl alcohol • Isopropyl alcohol • Pure water (after cleaning, the water must be removed by drying) • Drying condition: 90°C max., 30 sec. max. and 4 times max. 2. The effect of ultrasonic cleaning on the LED resin body depends on such factors as the oscillator output, size of PCB and LED mounting method. Ultrasonic cleaning is strongly recommended after confirming that there are no problems. 1. Ultrasonic wave frequency: 28 kHz or 40 kHz 2. Output: 20 W/I 3. The solvent for freon equivalent (recommended after confirming that there are no problems). • AK-225AES • Clean through • Pine alpha ST-100S Chemicals Ethyl alcohol Isopropyl alcohol Pure water Freon substitute detergent AK225AES Clean through 705H Pine alpha ST-100S * DIP Soldering and cleaning is not recommended for Alpha-Numeric (AAR121and AAA121).


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