Flash Memory. JS28F320J3D-75 Datasheet
Intel® Embedded Flash Memory (J3 v. D)
(32, 64, and 128 Mbit)
— High-density symmetrical 128-Kbyte
—128 Mbit (128 blocks)
—64 Mbit (64 blocks)
—32 Mbit (32 blocks)
— 75 ns Initial Access Speed (128/64/32
— 25 ns 8-word and 4-word
Asynchronous page-mode reads
— 32-Byte Write buffer
—4 µs per Byte Effective
— Enhanced security options for code
— 128-bit Protection Register
—64-bit Unique device identifier
—64-bit User-programmable OTP cells
— Absolute protection with VPEN = GND
— Individual block locking
— Block erase/program lockout during
— Program and erase suspend support
— Flash Data Integrator (FDI), Common
Flash Interface (CFI) Compatible
■ System Voltage and Power
— VCC = 2.7 V to 3.6 V
— VCCQ = 2.7 V to 3.6 V
■ Quality and Reliability
— Operating temperature:
-40 °C to +85 °C
— 100K Minimum erase cycles per block
— 0.13 µm ETOX™ VIII Process
— 56-Lead TSOP package
— 64-Ball Intel® Easy BGA package
The Intel® Embedded Flash Memory J3 Version D (J3 v. D) provides improved mainstream performance
with enhanced security features, taking advantage of the high quality and reliability of the NOR-based Intel
0.13 µm ETOX™ VIII process technology. Offered in 128-Mbit (16-Mbyte), 64-Mbit, and 32-Mbit
densities, the J3 v. D device brings reliable, low-voltage capability (3 V read, program, and erase) with high
speed, low-power operation.
The J3 v. D device takes advantage of the proven manufacturing experience and is ideal for code and data
applications where high density and low cost are required, such as in networking, telecommunications,
digital set top boxes, audio recording, and digital imaging.
Intel Flash Memory components also deliver a new generation of forward-compatible software support. By
using the Common Flash Interface (CFI) and Scalable Command Set (SCS), customers can take advantage
of density upgrades and optimized write capabilities of future Intel® Flash Memory devices.
Notice: This document contains information on new products in production. The specifications
are subject to change without notice. Verify with your local Intel sales office that you have the
latest datasheet before finalizing a design.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Embedded Flash Memory (J3 v. D) may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © 2005, Intel Corporation. All rights reserved.
Intel and ETOX are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.