Timer. HT1613C Datasheet

HT1613C Timer. Datasheet pdf. Equivalent

Part HT1613C
Description Timer
Feature www.DataSheet4U.com HT1613C Timer with Dialer Interface Patent Number: 84545 (R.O.C.) Patent Pendin.
Manufacture Holtek Semiconductor
Datasheet
Download HT1613C Datasheet




HT1613C
www.DataSheet4U.com
HT1613C
Timer with Dialer Interface
Features
Patent Number: 84545 (R.O.C.)
Patent Pending: 08/214, 079 (U.S.A.)
· Operating voltage: 1.2V~1.7V
· Low operating current: 3mA (typ.)
· Dialing number and conversation time display
· Conversation timer (59 mins and 59 secs max.)
· 8 or 10-digit LCD display driver; 3V, 1/2 bias, 1/3 duty (8
digit hand-held calculator LCD used for 8-digit applica-
tion)
· Real time clock with stopwatch
· Built-in dialer interface
· 12-hour or 24-hour format
· Uses 32768Hz crystal
· Two-button sequential operation for real time clock
setting
· Pad options
- Real time (RT)
- Auto change to timer mode (ACT)
- Extension phone number display (EPN)
· Blinking cursor waits for dialing number
· Last call time display
Applications
· Timers, clocks and watches
· LCD display drivers
· Telephone display interface
· Instrument display
General Description
The HT1613C is a CMOS chip designed for dialer inter-
faces driving 8 or 10 digit LCDs. Various functions, such
as real time clock, dialing number and conversation time
display are provided.
The HT1613C can display the real time or be blank by
default. When answering a telephone call, the timer is
activated to tell users how long the conversation has
taken. The HT1613C receives dialing data from the di-
aler and displays the phone number on the LCD from left
to right each time a phone call is made. By adding a
TIMER key, the HT1613C can provide the stopwatch
and timer reset/hold functions. Refer to the functional
description for details.
Block Diagram
X1
X2
T1
T2
DI
SK
S2
RES
T IM E R
1 2 /2 4
S1
HK
ACT
T im e
B ase
T im e r
S h ift
R e g is te r
S ta te
C o n tro l
C om m on
C ir c u it
D ecoder
&
M UX
C o n tro l
C ir c u it
S can
CKT
RT EPN
V o lta g e
D o u b le r
IN T
COM 1
COM 2
COM 3
VA
VB
VC
S egm ent
L a tc h
&
S e le c t
SEG 1
S E G 30
Rev. 1.10
1 August 17, 2001



HT1613C
w w w . D a t a S h e e t 4 UP.acdo mAssignment
HT1613C
54 53 52 51 50 49 48 47 46 45 44 43 42
S E G 28
S E G 29
S E G 30
COM 2
HK
1
2
3
4
5
S2 6
X2
X1
T2
T1
IN T
T IM E R
1 2 /2 4
S1
7
8
9
10
11
12
13
14
15
16 17 18 19
(0 ,0 )
20 21
22 23 24
41 S E G 14
40 S E G 13
39 S E G 12
38 S E G 11
37 S E G 10
36 S E G 9
35 S E G 8
34 S E G 7
33 S E G 6
32 S E G 5
31 S E G 4
30 S E G 3
29 S E G 2
28 S E G 1
27 C O M 3
26 C O M 1
25 R T
Chip size: 128 ´ 141 (mil)2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
X
-57.91
-57.91
-57.91
-57.91
-57.37
-57.37
-57.91
-57.91
-57.91
-57.91
-57.91
-57.91
-57.91
-57.91
-47.20
-33.43
-22.80
-16.37
Y
45.52
38.59
31.67
24.79
16.98
2.91
-8.60
-15.53
-22.49
-29.38
-36.26
-45.82
-54.20
-62.50
-62.50
-62.50
-62.46
-62.50
Pad No.
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
X
-10.25
2.76
11.94
32.97
39.86
46.74
58.10
58.10
58.10
58.10
58.10
58.10
58.10
58.10
58.10
58.10
58.10
58.10
Y
-61.96
-61.96
-62.50
-62.50
-62.50
-62.50
-62.46
-55.04
-48.16
-36.30
-28.95
-21.61
-15.22
-7.88
-0.54
6.81
14.15
21.50
Pad No.
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
X
58.10
58.10
58.10
58.10
58.10
37.26
29.91
22.57
15.23
7.88
0.54
-6.81
-14.15
-21.50
-28.84
-36.18
-43.53
-50.87
Unit: mil
Y
28.84
36.19
43.53
50.87
58.22
63.04
63.04
63.04
63.04
63.04
63.04
63.04
63.04
63.04
63.04
63.04
63.04
63.04
Rev. 1.10
2 August 17, 2001







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