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SIR460DP Dataheets PDF



Part Number SIR460DP
Manufacturers Vishay Siliconix
Logo Vishay Siliconix
Description N-Channel MOSFET
Datasheet SIR460DP DatasheetSIR460DP Datasheet (PDF)

New Product SiR460DP Vishay Siliconix N-Channel 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) (Ω) 0.0047 at VGS = 10 V 0.0061 at VGS = 4.5 V ID (A)a 40g 40g Qg (Typ.) 16.8 nC FEATURES • • • • Halogen-free According to IEC 61249-2-21 TrenchFET® Gen III Power MOSFET 100 % Rg Tested 100 % Avalanche Tested PowerPAK SO-8 APPLICATIONS • Notebook Vcore 6.15 mm S 1 2 3 S S • DC/DC 5.15 mm D G 4 D 8 7 6 5 D D D G Bottom View Ordering Information: SiR460DP-T1-GE3 (Lead (Pb)-free and Ha.

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New Product SiR460DP Vishay Siliconix N-Channel 30-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) (Ω) 0.0047 at VGS = 10 V 0.0061 at VGS = 4.5 V ID (A)a 40g 40g Qg (Typ.) 16.8 nC FEATURES • • • • Halogen-free According to IEC 61249-2-21 TrenchFET® Gen III Power MOSFET 100 % Rg Tested 100 % Avalanche Tested PowerPAK SO-8 APPLICATIONS • Notebook Vcore 6.15 mm S 1 2 3 S S • DC/DC 5.15 mm D G 4 D 8 7 6 5 D D D G Bottom View Ordering Information: SiR460DP-T1-GE3 (Lead (Pb)-free and Halogen-free) S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C TC = 25 °C TA = 25 °C L = 0.1 mH TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Temperature)d, e Symbol VDS VGS ID Limit 30 ± 20 40g 40g 24.3b, c 19.4b, c 70 40g 4.5b, c 30 45 48 31 5.0b, c 3.2b, c - 55 to 150 260 Unit V Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current Continuous Source-Drain Diode Current Single Pulse Avalanche Current Single Pulse Avalanche Energy IDM IS IAS EAS PD A mJ Maximum Power Dissipation W Operating Junction and Storage Temperature Range Soldering Recommendations (Peak TJ, Tstg °C THERMAL RESISTANCE RATINGS Symbol Typical Maximum Unit RthJA t ≤ 10 s 20 25 Maximum Junction-to-Ambientb, f °C/W RthJC 2.1 2.6 Maximum Junction-to-Case (Drain) Steady State Notes: a. Based on TC = 25 °C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. www.DataSheet4U.com e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under Steady State conditions is 65 °C/W. g. Package Limited. Document Number: 69095 S09-0140-Rev. A, 02-Feb-09 www.vishay.com 1 Parameter New Product SiR460DP Vishay Siliconix SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Dynamic b Symbol VDS ΔVDS/TJ ΔVGS(th)/TJ VGS(th) IGSS IDSS ID(on) RDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf td(on) tr td(off) tf IS ISM VSD trr Qrr ta tb Test Conditions VGS = 0 V, ID = 250 µA ID = 250 µA VDS = VGS, ID = 250 µA VDS = 0 V, VGS = ± 20 V VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 0 V, TJ = 55 °C VDS ≥ 5 V, VGS = 10 V VGS = 10 V, ID = 15 A VGS = 4.5 V, ID = 10 A VDS = 15 V, ID = 15 A Min. 30 Typ. Max. Unit V 29 - 5.5 1.0 2.4 ± 100 1 10 30 0.0038 0.0049 60 0.0047 0.0061 mV/°C V nA µA A Ω S Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time Currenta 2071 VDS = 15 V, VGS = 0 V, f = 1 MHz VDS = 15 V, VGS = 10 V, ID = 10 A VDS = 15 V, VGS = 4.5 V, ID = 10 A f = 1 MHz VDD = 15 V, RL = 1.5 Ω ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω 0.2 406 168 36 16.8 5.1 5.2 0.85 25 16 28 12 10 VDD = 15 V, RL = 1.5 Ω ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω 9 25 9 TC = 25 °C IS = 3 A 0.73 19 IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C 10 10 9 1.7 45 30 50 24 20 18 45 18 40 70 1.1 38 20 ns Ω 54 25.5 nC pF A V ns nC ns Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.DataSheet4U.com www.vishay.com 2 Document Number: 69095 S09-0140-Rev. A, 02-Feb-09 New Product SiR460DP Vishay Siliconix TYPICAL CHARACTERISTICS 70 VGS = 10 thru 4 V 56 I D - Drain Current (A) I D - Drain Current (A) 8 25 °C, unless otherwise noted 10 42 VGS = 3 V 28 6 4 TC = 25 °C 2 TC = 125 °C TC = - 55 °C 14 0 0.0 0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Output Characteristics 0.0060 2800 Transfer Characteristics R DS(on) - On-Resistance (Ω) 0.0055 C - Ca.


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