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AS3SSD16GB5PBG

Austin Semiconductor

Solid State Disk On Chip

AUSTIN SEMICONDUCTOR, INC. SOLID ST ATE DISK STA AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semicon...


Austin Semiconductor

AS3SSD16GB5PBG

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Description
AUSTIN SEMICONDUCTOR, INC. SOLID ST ATE DISK STA AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. Solid State Disk On Chip (SSDoC) FEATURES Capacities - 4 GB - 8 GB - 16 GB PATA Compatibility - ATA-5 compatible - UDMA4 supported - PIO Mode 4 supported - MWDMA Mode 2 supported Performance - Sustained Sequential Read Bandwidth:16 MB/s - Sustained Sequential Write Bandwidth: 5 MB/s Form Factor - BGA Package 31 mm (W) x 31 mm (L) x 4.2-7.8 mm (H) Weighs approximately 11 grams (TYP) Each NAND component, either a 4, 8 or 16Gb device, based on the use of single and stacked silicon solutions ECC correction = 6 Bytes within a 512 Byte sector www.DataSheet4U.com Automatic sleep mode Controller contained in base interposer SLC (Single-Level Cell) NAND Flash Reliability - Mean Time Between Failure (MTBF) >2,000,000 Hours (est.) - Program/Erase >1,000,000 Times (est.) - Temp Cycle 500/1000 cycles, JEDEC A104 Condition B -55ºC to +125ºC Power Supply Voltage: 5.0V or 3.3 V ± 10% (TYP) Power Consumption (Vcc = 5.0 V) - Idle: 10 mW (TYP) - Active: 255 mW (TYP) Operating Temperature - Commercial: 0C to 70C - Industrial: -45C to 85C Shock and Vibration - Shock: 1500G MIL-STD0810F - Vibration: 15 G RMS MIL-STD0810F Compliances - Lead free - RoHS - Sn/Pb Ball Option OVERVIEW The solid state disk is based on a proprietary package stacking technology to create an extremely space conscious, robust Solid State Disk. The SSD is cap...




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