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MAX14770E Dataheets PDF



Part Number MAX14770E
Manufacturers Maxim Integrated Products
Logo Maxim Integrated Products
Description High-ESD Profibus RS-485 Transceiver
Datasheet MAX14770E DatasheetMAX14770E Datasheet (PDF)

MAX14770E ±35kV High-ESD Profibus RS-485 Transceiver General Description The MAX14770E is a half-duplex, Q35kV high ESDprotected, 20Mbps transceiver for PROFIBUS-DP and RS-485 applications. In addition, it can be used for RS-422/V.11 communications. The MAX14770E is designed to meet IEC 61158-2, TIA/EIA-422-B, TIA/EIA485-A, V.11, and X.27 standards. The MAX14770E is available in an 8-pin SO and an 8-pin FMAX® specified over the extended temperature range. It is also available in a tiny TDFN (3m.

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MAX14770E ±35kV High-ESD Profibus RS-485 Transceiver General Description The MAX14770E is a half-duplex, Q35kV high ESDprotected, 20Mbps transceiver for PROFIBUS-DP and RS-485 applications. In addition, it can be used for RS-422/V.11 communications. The MAX14770E is designed to meet IEC 61158-2, TIA/EIA-422-B, TIA/EIA485-A, V.11, and X.27 standards. The MAX14770E is available in an 8-pin SO and an 8-pin FMAX® specified over the extended temperature range. It is also available in a tiny TDFN (3mm x 3mm) package and specified over the automotive (-40NC to +125NC) temperature range. PROFIBUS-DP Networks Industrial Fieldbuses Motion Controllers RS-485 Networks Machine Encoders Applications Benefits and Features S Integrated Protection Increases Robustness ±35kV HBM ESD per JEDEC JS-001-2012 ±12kV Contact ESD per IEC 61000-4-2 ±15kV Air Gap ESD per IEC 61000-4-2 True Fail-Safe Receiver Prevents False Transitions on Receiver Input Short or Open Hot Swap Eliminates False Transitions During Power-Up or Hot Insertion Short-Circuit-Protected Outputs Thermal Shutdown Circuitry Prevents Excessive Power Dissipation S Low Current Reduces Power Consumption 15µA Shutdown Current 2.5mA Supply Current Typical with No Load S Profibus Compliant with Minimum 20Mbps Data Rate S Allows Up to 128 Transceivers on the Bus S -40°C to +125°C Automotive Temperature Range in Tiny 8-Pin (3mm x 3mm) TDFN Typical PROFIBUS-DP Operating Circuit appears at end of data sheet. Functional Diagram Ordering Information PART TEMP RANGE PINPACKAGE MAX14770EESA+T -40NC to +85NC 8 SO MAX14770EGSA+T -40NC to +105NC 8 SO MAX14770EGUA+T -40NC to +105NC 8 FMAX MAX14770EATA+T -40NC to +125NC 8 TDFN-EP* +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. *EP = Exposed pad. TOP MARK — — — BMG RO R RE SHUTDOWN DE A B DI D MAX14770E The PROFIBUS PROCESS FIELD BUS logo is a registered trademark of PROFIBUS and PROFINET International (PI). µMAX is a registered trademark of Maxim Integrated Products, Inc. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com. 19-5017; Rev 5; 1/15 MAX14770E ±35kV High-ESD Profibus RS-485 Transceiver ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND.) VCC........................................................................-0.3V to +6.0V RE, RO........................................................-0.3V to (VCC + 0.3V) DE, DI....................................................................-0.3V to +6.0V A, B......................................................................-8.0V to +13.0V Short-Circuit Duration (RO, A, B) to GND..................Continuous Continuous Power Dissipation (TA = +70NC) SO (derate 7.6mW/NC above +70NC)..........................606mW TDFN (derate 24.4mW/NC above +70NC)..................1951mW FMAX (derate 4.8mW/NC above +70NC)...................387.8mW Operating Temperature Range MAX14470EESA...............................................-40NC to +85NC MAX14470EG_A.............................................. -40NC to +105NC MAX14470EATA.............................................. -40NC to +125NC Storage Temperature Range............................. -65NC to +150NC Junction Temperature Range............................ -40NC to +150NC Lead Temperature (soldering, 10s).................................+300NC Soldering Temperature (reflow).......................................+260NC PACKAGE THERMAL CHARACTERISTICS (Note 1) SO Junction-to-Ambient Thermal Resistance (qJA).........132°C/W Junction-to-Case Thermal Resistance (qJC)...............38°C/W µMAX Junction-to-Ambient Thermal Resistance (qJA)......206.3°C/W Junction-to-Case Thermal Resistance (qJC)...............42°C/W TDFN Junction-to-Ambient Thermal Resistance (qJA)...........41°C/W Junction-to-Case Thermal Resistance (qJC).................8°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +5V Q10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V, TA = +25NC.) (Note 2) PARAMETER Power-Supply Range Supply Current Shutdown Supply Current DRIVER Differential Driver Output Differential Driver Peak-to-Peak Output SYMBOL VCC ICC ISH CONDITIONS DE = 1, RE = 0 or DE = 0, RE = 0 or DE = 1, RE = 1; no load DE = 0, RE = 1 |VOD| VODPP RL.


XR17V358 MAX14770E BUK9875-100A


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