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IS43R16320A

Integrated Silicon Solution

32Meg x 16 512-MBIT DDR SDRAM

IS43R16320A 32Meg x 16 512-MBIT DDR SDRAM FEATURES DEVICE OVERVIEW ISSI MARCH 2006 ® • • • • • • • • • • • • Clock F...


Integrated Silicon Solution

IS43R16320A

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IS43R16320A 32Meg x 16 512-MBIT DDR SDRAM FEATURES DEVICE OVERVIEW ISSI MARCH 2006 ® Clock Frequency: 166 MHz Power supply (VDD and VDDQ) DDR 333: 2.5V + 0.2V SSTL 2 interface Four internal banks to hide row Pre-charge and Active operations Commands and addresses register on positive clock edges (CK) Bi-directional Data Strobe signal for data capture Differential clock inputs (CK and CK) for two data accesses per clock cycle Data Mask feature for Writes supported DLL aligns data I/O and Data Strobe transitions with clock inputs Programmable burst length for Read and Write operations Programmable CAS Latency (2 or 2.5 clocks) ISSI’s 512-Mbit DDR SDRAM achieves high-speed data transfer using pipeline architecture and two data word accesses per clock cycle. The 536,870,912-bit memory array is internally organized as four banks of 128M-bit to allow concurrent operations. The pipeline allows Read and Write burst accesses to be virtually continuous, with the option to concatenate or truncate the bursts. The programmable features of burst length, burst sequence and CAS latency enable further advantages. The device is available in 16-bit data word size. Input data is registered on the I/O pins on both edges of Data Strobe signal(s), while output data is referenced to both edges of Data Strobe and both edges of CK. Commands are registered on the positive edges of CK. Auto Refresh, Active Power Down, and Pre-charge Power Down modes are enabled by using cloc...




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