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CLS01 Dataheets PDF



Part Number CLS01
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description Switching-Mode Power Supply
Datasheet CLS01 DatasheetCLS01 Datasheet (PDF)

CLS01 TOSHIBA Schottky Barrier Diode CLS01 Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage) DC/DC Converter Applications ② Unit: mm • • • • Forward voltage: VFM = 0.47 V (max) Average forward current: IF (AV) = 10 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package: “L−FLATTM” (Toshiba package name) ① Absolute Maximum Ratings (Ta = 25°C) Characteristics Repetitive peak reverse voltage Average forward.

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CLS01 TOSHIBA Schottky Barrier Diode CLS01 Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage) DC/DC Converter Applications ② Unit: mm • • • • Forward voltage: VFM = 0.47 V (max) Average forward current: IF (AV) = 10 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package: “L−FLATTM” (Toshiba package name) ① Absolute Maximum Ratings (Ta = 25°C) Characteristics Repetitive peak reverse voltage Average forward current Non-repetitive peak surge current Junction temperature Storage temperature range Symbol VRRM IF (AV) IFSM Tj Tstg Rating 30 10 (Note 1) 100 (50 Hz) −40~125 −40~150 Unit A A °C °C ① ① ANODE アノード ②CATHODE ② カソード Note 1: Tℓ = 88°C Rectangular waveform (α = 180°), VR = 15 V JEDEC JEITA ⎯ ⎯ TOSHIBA 3-4F1A Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in Weight: 0.15 g (typ.) temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook www.DataSheet4U.com (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Peak repetitive reverse current Junction capacitance IRRM (1) IRRM (2) Cj Test Condition IFM = 3.0 A (pulse test) IFM = 5.0 A (pulse test) IFM = 10 A (pulse test) VRRM = 5 V (pulse test) VRRM = 30 V (pulse test) VR = 10 V, f = 1.0 MHz Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm ⎯ Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Typ. 0.34 0.38 0.45 8.0 0.1 530 Max ⎯ ⎯ 0.47 ⎯ 1.0 ⎯ μA mA pF V Unit Thermal resistance (junction to ambient) Rth (j-a) ⎯ ⎯ 100 °C/W Thermal resistance (junction to lead) Rth (j-ℓ) ⎯ ⎯ 5 °C/W 1 2006-11-13 3 .2±0.2 V CLS01 Marking Abbreviation Code S01 Part No. CLS01 Standard Soldering Pad Unit: mm 5.9 2.5 1.8 2.6 4.8 Handling Precautions 1) Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility that SBDs will cause thermal runaway when used under high-temperature or high-voltage conditions. Be sure to take forward and reverse loss into consideration during design. The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for when designing a circuit incorporating this device. VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account when designing a device for operation at low www.DataSheet4U.com temperatures. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF (AV) and that Tj be below 100°C. When using this device, take the margin into consideration by using an allowable Tamax-IF (AV) curve. IFSM: This rating specifies the non-repetitive peak current. This applies only to abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using the device in order to ensure high reliability. We recommend that the device be used at a Tj of below 100°C. 2) 3) Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the databook on Rectifiers for further information. 4) 2.9 2 2006-11-13 CLS01 iF – vF (A) 100 7.0 PF (AV) – IF (AV) Average forward power dissipation PF (AV) (W) DC 6.0 180° 5.0 α = 60° 4.0 3.0 2.0 1.0 0.0 0 0° 0° α α 360° 360° Conduction Conduction angle angle α α 4 8 12 16 Rectangular Rectangular waveform waveform 120° iF Tj = 125°C 10 75°C 1 Instantaneous forward current 25°C 0.1 Pulse test 0.01 0.0 0.2 0.4 0.6 0.8 Instantaneous forward voltage vF (V) Average forward current IF (AV) (A) Tℓ max – IF (AV) 140 140 Ta max – IF (AV) Maximum allowable temperature Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm Maximum allowable lead temperature Tℓ max (°C) 120 100 80 60 40 20 0 0 120 100 Ta max (°C) α = 60° Rectangular waveform 120° 180° DC 80 DC 60 40 20 0 0 180° 120° α = 60° Rectangular waveform 0° α 360° IF (AV) Conduction angle α VR = 15 V 4 8 12 16 0° α 360° IF (AV) Conduction angle α VR = 15 V 8 12 16 4 www.DataSheet4U.comAver.


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