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SL2ICS2001DW Dataheets PDF



Part Number SL2ICS2001DW
Manufacturers NXP
Logo NXP
Description I-CODE SLI Label IC bumped wafer specification on UV-tape
Datasheet SL2ICS2001DW DatasheetSL2ICS2001DW Datasheet (PDF)

SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. 2. Ordering information Table 1. Ordering information Package Name Description Bumped die on s.

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VGO36 SL2ICS2001DW SL2ICS2001V1D


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