MCIMX31C

Freescale Semiconductor Data Sheet: Technical Data Document Number: MCIMX31C Rev. 4, 6/2008 MCIMX31C and MCIMX31LC MCIMX31C and MCIMX31LC Multimedia Applications Processors for Industrial and Automotive Products 1 Introduction Package Information Plastic Package Case 1931 19 x 19 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information. Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2 Ordering Information . . . . . . . . . . . . . . . . . 3 1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 3 2 Functional Description and Application Information . . . . . . . . . . . . . . . . . 4 2.1 ARM11 Microprocessor Core . . . . . . . . . . . 4 2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 5 3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . 9 4 Electrical Characteristics . . . . . . . . . . . . . . . 10 4.1 Chip-Level Conditions . . . . . . . . . . . . . . . 10 4.2 Supply Power-Up/Power-Down Requirements and Restrictions . . . . . . . . 15 4.3 Module-Level Electrical Specifications . . . 16 5 Package Information and Pinout . . . . . . . . . 99 5.1 MAPBGA Production Package 473 19 x 19 mm, 0.8 mm Pitch . . . . . . . 100 6 Product Differences . . . . . . . . . . . . . . . . . . 108 7 Product Documentation . . . . . . . . . . . . . . . 109 7.1 Revision History . . . . . . . . . . . . . . . . . . . 109 The MCIMX31C ...