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SMD12 Dataheets PDF



Part Number SMD12
Manufacturers SeCoS
Logo SeCoS
Description (SMD03 - SMD36) 300W TVS DIODE
Datasheet SMD12 DatasheetSMD12 Datasheet (PDF)

SMD03 THRU SMD36 Elektronische Bauelemente RoHS Compliant Product 300W TVS DIODE FEATURES ¡ESC59 package for surface mount appllcation ¡EProtects 3.3V up through 36V components ¡EProtects two unidirectional line or one bidirection line ¡EProvides electrically is olated protection ¡EESD>10KV ¡E300W Peak Power Protection( tp=8/2 us) V A 3 SC-59 L B S Dim A B C D G C 2 Min 2.700 1.500 0.900 0.350 1.700 0.013 0.100 0.350 0.900 2.600 0.500 Max 3.100 1.700 1.150 0.500 2.100 0.100 0.200 0.550 1.

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SMD03 THRU SMD36 Elektronische Bauelemente RoHS Compliant Product 300W TVS DIODE FEATURES ¡ESC59 package for surface mount appllcation ¡EProtects 3.3V up through 36V components ¡EProtects two unidirectional line or one bidirection line ¡EProvides electrically is olated protection ¡EESD>10KV ¡E300W Peak Power Protection( tp=8/2 us) V A 3 SC-59 L B S Dim A B C D G C 2 Min 2.700 1.500 0.900 0.350 1.700 0.013 0.100 0.350 0.900 2.600 0.500 Max 3.100 1.700 1.150 0.500 2.100 0.100 0.200 0.550 1.000 3.000 0.600 1 Top View G MECHANICAL DATA ¡EMolded: SC59 Surface Mount ¡EBody marked with marking code. ¡EMounting Position: Any ¡EWeight: 0.008 grams (approx.) D H H J K J K L S V APPLICATIONS 3 1 2 1 3 2 ¡ECellular Handsets and Accessories ¡EPortable Electronics ¡EIndustrial Controls ¡ESet -Top Box ¡EServers, Notebook, and Desktop PC All Dimension in mm MAXIMUM RATING SAND ELECTRICAL CHARACTERISTICS Rating Peak ulse Power (tp=8/20us) Thermal Resistance, Junction to Ambient www.DataSheet4U.com Symbol Ppk RθJA TL TJ TSTG Value 300 556 260 (10 sec.) -55 to +125 -55 to +150 Units Watts ¢J/W ¢J ¢J ¢J Lead Soldering Temperature Operating Temperature Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25º C Unless otherwise specified STAND OFF VOLTAGE VWM VOLTS BREAKDOWN VOLTAGE VBR @1 mA VOLTS MIN SMD03 SMD05 SMD12 SMD15 SMD24 SMD36 X03 X05 X12 X15 X24 X36 3.3 5.0 12.0 15.0 24.0 36.0 4-5 6.1-7.4 13.3-16.3 16.7-20.4 26.7-32.6 40.0-47.0 CLAMPING VOLTAGE VC @ 1 Amp (FIGURE 2) VOLTS MAX 7 9.8 19 24 43 60 CLAMPING VOLTAGE VC @ 5 Amp (FIGURE 2) VOLTS MAX 8.5 11 24 30 55 75 LEAKAGE CURRENT ID @ V WM µA MAX 100 12 0.5 0.5 0.5 0.5 PART NUMBER DEVICE MARKING CAPACITANCE @0V, 1 MHz C Pin 1-3 pF MAX 350 210 75 50 30 30 NOTE: Transient Voltage Suppression (TVS) product is normally selected based on its stand off Voltage VWM. Product selected voltage should be equal to or greater than the continuous peak operating voltage of the circuit to be protected. http://www.SeCoSGmbH.com Any changing of specification will not be informed individual 16-Oct.-2008 Rev. D Page 1 of 2 SMD03 THRU SMD36 Elektronische Bauelemente 300W TVS DIODE Non-Repetitive Peak Pulse Power vs. Pulse Time 10 110 PP (kW) Power Derating Curve 100 % of Rated Power or I PP 90 80 70 60 50 40 30 20 10 0 Peak Puse Power - P 1 0. 1 0. 01 0.1 1 10 100 1000 0 25 50 75 100 125 150 P ulse Duration - tp (u s) Ambient Temperature - TA ( o C) Applications Information 110 100 90 80 Pulse Waveform Wave form Paramete rs: tr = 8 s td = 20 s e -t Device Connection Options The SM series is designed to protect one unidirectional data or l/O lines operating at 5 to 36 volts.Connection options are as follows: ¡EUnidirectional:Data lines are connected to pin1 and Pin 3 is connected to ground.For best results,this pin should be connected directly to a ground plane on the board.The path lengh should be kept as short as possible to minimize parasitic inductance. Circuit Board Layout Recommendations for suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD.The following guidelines are recommended (Refer to application note Sl99.01 for more detailed information): ¡EPlace the TVS near the input terminals or connectors to restrict transient coupling. ¡EMinimize the path length between the TVS and the protected line. ¡EMinimize all conductive loops including power and ground loops. ¡EThe ESD transient return path toground should be kept as short as possible. ¡ENever run critical signals near board edges ¡EUse ground planes whenever possib|e. Percent of I PP 70 60 50 40 30 20 td = I PP /2 10 www.DataSheet4U.com 0 0 5 10 15 20 25 30 Time (us) http://www.SeCoSGmbH.com Any changing of specification will not be informed individual 16-Oct.-2008 Rev. D Page 2 of 2 .


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