64Mb H-die SDRAM Specification 54 TSOP-II
SDRAM 64Mb H-die (x4, x8, x16)
CMOS SDRAM
64Mb H-die SDRAM Specification
54 TSOP-II with Pb-Free (RoHS compliant)
Rev...
Description
SDRAM 64Mb H-die (x4, x8, x16)
CMOS SDRAM
64Mb H-die SDRAM Specification
54 TSOP-II with Pb-Free (RoHS compliant)
Revision 1.3 August 2004
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 1.3 August 2004
SDRAM 64Mb H-die (x4, x8, x16)
Revision History Revision 1.0 (September, 2003)
Finalized
CMOS SDRAM
Revision 1.1 (October, 2003)
Deleted speed -7C and AC parameter notes 5.
Revision 1.2 (May, 2004)
Added Note 5. sentense of tRDL parameter
Revision 1.3 (August, 2004)
Corrected typo.
Rev. 1.3 August 2004
SDRAM 64Mb H-die (x4, x8, x16)
CMOS SDRAM
4M x 4Bit x 4 / 2M x 8Bit x 4 / 1M x 16Bit x 4 Banks Synchronous DRAM
FEATURES
JEDEC standard 3.3V power supply LVTTL compatible with multiplexed address Four banks operation MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) All inputs are sampled at the positive going edge of the system clock Burst read single-bit write operation DQM (x4,x8) & L(U)DQM (x16) for masking Auto & self refresh 64ms refresh period (4K cycle)
Pb-free Package
RoHS compliant
GENERAL DESCRIPTION
The K4S640432H / K4S640832H / K4S641632H is 67,108,864 bits synchronous high data rate Dynamic RAM organized as 4 x 4,194,304 words by 4 bits, / 4 x 2,097,152 words by 8 bits, / 4 x 1,048,576 words by 16 bits, fabricated with SAMSUNG′s high performance CMOS technology. Synchronous design all...
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