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CSMC30XSC Dataheets PDF



Part Number CSMC30XSC
Manufacturers Cystech Electonics
Logo Cystech Electonics
Description 3.0Amp. Surface Mount Rectifier
Datasheet CSMC30XSC DatasheetCSMC30XSC Datasheet (PDF)

CYStech Electronics Corp. 3.0Amp. Surface Mount Rectifier www.DataSheet4U.com Spec. No. : C344SC Issued Date : 2003.10.29 Revised Date : Page No. : 1/3 CSMC30XSC Series Features • For surface mounted applications. • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Glass passivated junction • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data • Case: Mol.

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CYStech Electronics Corp. 3.0Amp. Surface Mount Rectifier www.DataSheet4U.com Spec. No. : C344SC Issued Date : 2003.10.29 Revised Date : Page No. : 1/3 CSMC30XSC Series Features • For surface mounted applications. • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Glass passivated junction • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data • Case: Molded plastic, SMC/JEDEC DO-214AB. • Terminals: Solder plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. • Weight: 0.195 gram, 0.00585 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=3A (Note 1) Average forward rectified current Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TA=25℃(Note 1) VR=VRRM,TA=125℃(Note 1) Maximum thermal resistance, Junction to ambient(Note 2) Diode junction capacitance @ f=1MHz and applied 4VDC reverse voltage Storage temperature Operating temperature Type Symbol CSMC CSMC CSMC CSMC CSMC CSMC CSMC Units 301 302 303 304 305 306 307 VRRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VR 50 100 200 400 600 800 1000 V VF IO IFSM 1.1 3 100 V A A IR Rth,JA CJ Tstg TJ 5 250 47 (typ) 40(typ) -55 ~ +150 -55 ~ +150 µA µA ℃/W pF ℃ ℃ Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle 2 .Mounted on PCB with 30mm² (0.013mm thickness) copper pad area. CSMC30XSC CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Current Derating Curve 3.5 Average Forward Current---I O(A) Forward Current---I F(A) 3 2.5 2 1.5 1 0.5 0 0 20 40 60 80 100 120 140 160 Ambient Temperature---TA(℃) 0.01 0.6 0.7 0.8 0.9 Single Phase, Half Wave 60Hz, Resistive or Inductive Load www.DataSheet4U.com Spec. No. : C344SC Issued Date : 2003.10.29 Revised Date : Page No. : 2/3 Forward Current vs Forward Voltage 100 10 1 Tj=25℃ Pulse Width=300μs Duty Cycle=1% 0.1 1 1.1 1.2 1.3 Forward Voltage---VF(V) Maximum Non-Repetitive Forward Surge Current 250 Junction Capacitance---C J(pF) Peak Forward Surge Current--IFSM (A) 200 150 100 50 0 1 10 Numbers of Cycles at 60Hz 100 Tj=25℃, 8.3ms Single Half Sine Wave, JEDEC method Junction Capacitance vs Reverse Voltage 120 100 80 60 40 20 0 0.01 0.1 1 10 100 Reverse Voltage---VR(V) Reverse Leakage Current vs Reverse Voltage 100 Reverse Leakage Current---(A) 10 Tj = 100℃ 1 Tj = 25℃ 0.1 0.01 0 20 40 60 80 100 120 140 Percentage of Rated Peak Reverse Voltage---(%) CSMC30XSC CYStek Product Specification CYStech Electronics Corp. SMC/DO-214AB Dimension www.DataSheet4U.com Spec. No. : C344SC Issued Date : 2003.10.29 Revised Date : Page No. : 3/3 Marking Code: Device CSMC 301 Code A31 Device CSMC 305 Code A35 CSMC 302 A32 CSMC 306 A36 CSMC 303 A33 CSMC 307 A37 CSMC 304 A34 SMC/DO-214AB Plastic Surface Mounted Package CYStek Package Code: SC *:Typical DIM A B C D Inches Min. Max. 0.260 0.276 0.173 0.189 0.012(typ) 0.144 0.152 Millimeters Min. Max. 6.6 7.0 4.4 4.8 0.3(typ) 3.6 3.8 DIM E F G H Inches Min. Max. 0.228 0.244 0.071 0.087 0.032(typ) 0.04(typ) Millimeters Min. Max. 5.8 6.2 1.8 2.2 0.8(typ) 1.0(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CSMC30XSC CYStek Product Specification .


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