(CY7C1371DV25 / CY7C1373DV25) Flow-Through SRAM
CY7C1371DV25 www.DataSheet4U.com CY7C1373DV25
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM with NoBL™ Architecture
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Description
CY7C1371DV25 www.DataSheet4U.com CY7C1373DV25
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM with NoBL™ Architecture
Features
No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles Can support up to 133-MHz bus operations with zero wait states — Data is transferred on every clock Pin compatible and functionally equivalent to ZBT™ devices Internally self-timed output buffer control to eliminate the need to use OE Registered inputs for flow-through operation Byte Write capability 2.5V core power supply (VDD) 2.5V I/O power supply (VDDQ) Fast clock-to-output times — 6.5 ns (for 133-MHz device) Clock Enable (CEN) pin to enable clock and suspend operation Synchronous self-timed writes Asynchronous Output Enable Available in JEDEC-standard lead-free 100-Pin TQFP, lead-free and non-lead-free 119-Ball BGA and 165- Ball FBGA package. Three chip enables for simple depth expansion Automatic Power-down feature available using ZZ mode or CE deselect IEEE 1149.1 JTAG-Compatible Boundary Scan Burst Capability—linear or interleaved burst order Low standby power
Functional Description[1]
The CY7C1371DV25/CY7C1373DV25 is a 2.5V, 512K x 36/1M x 18 Synchronous Flow-through Burst SRAM designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1371DV25/CY7C1373DV25 is equipped with the advanced No Bus Latency (NoBL) logic required to enable consecutive Read/...
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