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UPD703217A Dataheets PDF



Part Number UPD703217A
Manufacturers NEC
Logo NEC
Description 32-Bit Single-Chip Microcontrollers
Datasheet UPD703217A DatasheetUPD703217A Datasheet (PDF)

www.DataSheet4U.com User’s Manual V850ES/KF1 , V850ES/KG1 , V850ES/KJ1 32-Bit Single-Chip Microcontrollers Hardware TM TM TM V850ES/KF1: µPD703208 µPD703208(A) µPD703208Y µPD703208Y(A) µPD703209 µPD703209(A) µPD703209Y µPD703209Y(A) µPD703210 µPD703210(A) µPD703210Y µPD703210Y(A) µPD70F3210 µPD70F3210(A) µPD70F3210Y µPD70F3210Y(A) V850ES/KG1: µPD703212 µPD703212(A) µPD703212Y µPD703212Y(A) µPD703213 µPD703213(A) µPD703213Y µPD703213Y(A) µPD703214 µPD703214(A) µPD703214Y µPD703214Y(A) µPD7.

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www.DataSheet4U.com User’s Manual V850ES/KF1 , V850ES/KG1 , V850ES/KJ1 32-Bit Single-Chip Microcontrollers Hardware TM TM TM V850ES/KF1: µPD703208 µPD703208(A) µPD703208Y µPD703208Y(A) µPD703209 µPD703209(A) µPD703209Y µPD703209Y(A) µPD703210 µPD703210(A) µPD703210Y µPD703210Y(A) µPD70F3210 µPD70F3210(A) µPD70F3210Y µPD70F3210Y(A) V850ES/KG1: µPD703212 µPD703212(A) µPD703212Y µPD703212Y(A) µPD703213 µPD703213(A) µPD703213Y µPD703213Y(A) µPD703214 µPD703214(A) µPD703214Y µPD703214Y(A) µPD70F3214 µPD70F3214(A) µPD70F3214Y µPD70F3214Y(A) V850ES/KJ1: µPD703216 µPD703216(A) µPD703216Y µPD703216Y(A) µPD703217 µPD703217(A) µPD703217Y µPD703217Y(A) µPD70F3217 µPD70F3217(A) µPD70F3217Y µPD70F3217Y(A) Document No. U15862EJ3V0UD00 (3rd edition) Date Published January 2003 N CP(K) 2002 Printed in Japan [MEMO] www.DataSheet4U.com 2 User’s Manual U15862EJ3V0UD www.DataSheet4U.com NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Purchase of NEC Electronics I C components conveys a license under the Philips I C Patent Rights to use these components in an I C system, provided that the system conforms to the I C Standard Specification as defined by Philips. 2 2 2 2 V850 Series, V850ES/KF1, V850ES/KG1, and V850ES/KJ1 are trademarks of NEC Electronics Corporation. User’s Manual U15862EJ3V0UD 3 www.DataSheet4U.com These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to the law of that country is prohibited. • The information in this document is current as of November, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circui.


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