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DS3171 Dataheets PDF



Part Number DS3171
Manufacturers Maxim
Logo Maxim
Description Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers
Datasheet DS3171 DatasheetDS3171 Datasheet (PDF)

www.DataSheet4U.com DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION The DS3171, DS3172, DS3173, and DS3174 (DS317x) combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper lines. FUNCTIONAL DIAGRAM APPLICATIONS Access Concentrators SONET/SDH ADM and Muxes PBXs Digital Cross Connect Test Equipment Routers and Switches Multiservice Access Platform (MSAP) Multiservice Protocol Platform .

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www.DataSheet4U.com DS3171/DS3172/DS3173/DS3174 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers www.maxim-ic.com GENERAL DESCRIPTION The DS3171, DS3172, DS3173, and DS3174 (DS317x) combine a DS3/E3 framer(s) and LIU(s) to interface to as many as four DS3/E3 physical copper lines. FUNCTIONAL DIAGRAM APPLICATIONS Access Concentrators SONET/SDH ADM and Muxes PBXs Digital Cross Connect Test Equipment Routers and Switches Multiservice Access Platform (MSAP) Multiservice Protocol Platform (MSPP) PDH Multiplexer/ Demultiplexer Integrated Access Device (IAD) DS3/E3 PORTS DS3/ E3 LIU DS3/E3 FRAMER/ FORMATTER SYSTEM BACKPLANE DS317x ORDERING INFORMATION PART DS3171* DS3171N* DS3172* DS3172N* DS3173* DS3173N* DS3174 DS3174N TEMP RANGE 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C PIN-PACKAGE 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) 400 TE-CSBGA (27mm x 27mm, 1.27mm pitch) FEATURES § § § § § § § § § § § § § Single (DS3171), Dual (DS3172), Triple (DS3173), or Quad (DS3174) Single-Chip Transceiver for DS3 and E3 All Four Devices are Pin Compatible for Ease of Port Density Migration in the Same Printed Circuit Board Platform Each Port Independently Configurable Performs Receive Clock/Data Recovery and Transmit Waveshaping for DS3 and E3 Jitter Attenuator can be Placed Either in the Receive or Transmit Paths Interfaces to 75W Coaxial Cable at Lengths Up to 380 meters, or 1246 feet (DS3) or 440 meters, or 1443 feet (E3) Uses 1:2 Transformers on Both Tx and Rx On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or G.832) Framer(s) Ports Independently Configurable for DS3, E3 Built-In HDLC Controllers with 256-Byte FIFOs for the Insertion/Extraction of DS3 PMDL, G.751 Sn Bit, and G.832 NR/GC Bytes On-Chip BERTs for PRBS and Repetitive Pattern Generation, Detection, and Analysis Large Performance-Monitoring Counters for Accumulation Intervals of at Least 1 Second Flexible Overhead Insertion/Extraction Ports for DS3, E3 Framers *Future product—contact factory for availability. Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata. 1 of 230 REV: 102204 DS3171/DS3172/DS3173/DS3174 www.DataSheet4U.com FEATURES (CONTINUED) § Loopbacks Include Line, Diagnostic, Framer, Payload, and Analog with Capabilities to Insert AIS in the Directions Away from Loopback Directions Ports can be Disabled to Reduce Power Integrated Clock Rate Adapter to Generate the Remaining Internally Required 44.736MHz (DS3) and 34.368MHz (E3) from a Single Clock Reference Source at One of Three Standard Frequencies (DS3, E3, STS-1) § § § § § § § § Pin Compatible with the DS318x Family of Devices and the DS316x Family of Devices 8-/16-Bit Generic Microprocessor Interface Low-Power (~1.73W) 3.3V Operation (5V Tolerant I/O) Small High-Density Thermally Enhanced ChipScale BGA Packaging (TE-CSBGA) with 1.27mm Pin Pitch Industrial Temperature Operation: -40°C to +85°C IEEE1149.1 JTAG Test Port DETAILED DESCRIPTION The DS3171 (single), DS3172 (dual), DS3173 (triple), and DS3174 (quad) perform framing, formatting, and line transmission and reception. These devices contain integrated LIU(s), framer/formatter for M23 DS3, C-bit DS3, G.751 E3, G.832 E3, or a combination of the above signal formats. Each LIU has independent receive and transmit paths. The receiver LIU block performs clock and data recovery from a B3ZS- or HDB3-coded AMI signal and monitors for loss of the incoming signal, or can be bypassed for direct clock and data inputs. The receiver LIU block optionally performs B3ZS/HDB3 decoding. The transmitter LIU drives standard pulse-shape waveforms onto 75W coaxial cable or can be bypassed for direct clock and data outputs. The jitter attenuator can be placed in either transmit or receive data path when the LIU is enabled. The DS3/E3 framers transmit and receive serial data in properly formatted M23 DS3, C-bit DS3, G.751 E3, or G.832 E3 data streams. Unused functions can be powered down to reduce device power. The DS317x DS3/E3 SCTs conform to the telecommunications standards listed in Section 4. 2 of 230 DS3171/DS3172/DS3173/DS3174 www.DataSheet4U.com 1 BLOCK DIAGRAMS Figure 1-1 shows the external components required at each LIU interface for proper operation. Figure 1-2 shows the functional block diagram of one channel DS3/E3 LIU. Figure 1-1. LIU External Connections for a DS3/E3 Port of a DS317x Device Transmit Each DS3/E3 LIU Interface TXP 330W (1%) VDD VDD 0.01uF 0.1uF 1uF 0.01uF 0.1uF 1uF 3.3V Power P.


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