DatasheetsPDF.com

HYB18T256324F-16 Dataheets PDF



Part Number HYB18T256324F-16
Manufacturers Infineon Technologies AG
Logo Infineon Technologies AG
Description 256-Mbit GDDR3 DRAM [600MHz]
Datasheet HYB18T256324F-16 DatasheetHYB18T256324F-16 Datasheet (PDF)

Data Sheet, Rev. 1.11, April 2005 www.DataSheet4U.com HYB18T256324F–16 HYB18T256324F–20 HYB18T256324F–22 256-Mbit GDDR3 DRAM [600MHz] RoHS compliant Memory Products N e v e r s t o p t h i n k i n g . www.DataSheet4U.com Edition 04-2005 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a gu.

  HYB18T256324F-16   HYB18T256324F-16


Document
Data Sheet, Rev. 1.11, April 2005 www.DataSheet4U.com HYB18T256324F–16 HYB18T256324F–20 HYB18T256324F–22 256-Mbit GDDR3 DRAM [600MHz] RoHS compliant Memory Products N e v e r s t o p t h i n k i n g . www.DataSheet4U.com Edition 04-2005 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Under no circumstances may the Infineon Technologies product as referred to in this data sheet be used in 1. Any applications that are intended for military usage (including but not limited to weaponry), or 2. Any applications, devices or systems which are safety critical or serve the purpose of supporting, maintaining, sustaining or protecting human life (such applications, devices and systems collectively referred to as "Critical Systems"), if a) A failure of the Infineon Technologies product can reasonable be expected to - directly or indirectly (i) Have a detrimental effect on such Critical Systems in terms of reliability, effectiveness or safety; or (ii) Cause the failure of such Critical Systems; or b) A failure or malfunction of such Critical Systems can reasonably be expected to - directly or indirectly (i) Endanger the health or the life of the user of such Critical Systems or any other person; or (ii) Otherwise cause material damages (including but not limited to death, bodily injury or significant damages to property, whether tangible or intangible). HYB18T256324F–[16/20/22] www.DataSheet4U.com 256-Mbit DDR SGRAM HYB18T256324F–16 HYB18T256324F–20 HYB18T256324F–22 Revision History: Previous Revision: Page 2 30 75 79 Rev. 1.11 Rev. 1.0 04-2005 Subjects (major changes since last revision) added disclaimer figure 11: note 1 changed table 41: added currents for -16 table 42-44: new values We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Data Sheet 3 Rev. 1.11, 04-2005 10292004-DOXT-FS0U HYB18T256324F–[16/20/22] www.DataSheet4U.com 256-Mbit DDR SGRAM Table of Contents 1 1.1 1.2 2 2.1 2.2 2.3 2.3.1 2.3.2 2.4 2.4.1 2.4.2 2.4.3 3 3.1 3.2 3.3 3.3.1 3.3.2 3.3.3 3.3.4 3.4 3.4.1 3.4.2 3.4.3 3.4.4 3.4.5 3.4.6 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.5.6 3.6 3.7 3.7.1 3.7.2 3.7.3 3.7.3.1 3.7.3.2 3.7.4 3.7.5 3.7.6 3.7.7 3.7.8 3.8 3.8.1 3.8.2 3.8.3 3.8.3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ball Definition and Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Command Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Description of Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . State Diagram and Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . State Diagram for One Activated Bank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Function Truth Table for more than one Activated Bank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Function Truth Table for CKE . . . . . . . . . . . . . . . . . . . . . . . . . . . .


K4S64163LH-RBF HYB18T256324F-16 HYB18T256324F-20


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)