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GS8150V18AB-300

GSI Technology

1M x 18/ 512K x 36 18Mb Register-Register Late Write SRAM

Product Preview GS8150V18/36AB-357/333/300/250 www.DataSheet4U.com 119-Bump BGA Commercial Temp Industrial Temp Feature...


GSI Technology

GS8150V18AB-300

File Download Download GS8150V18AB-300 Datasheet


Description
Product Preview GS8150V18/36AB-357/333/300/250 www.DataSheet4U.com 119-Bump BGA Commercial Temp Industrial Temp Features Register-Register Late Write mode, Pipelined Read mode 1.8 V +150/–100 mV core power supply 1.5 V or 1.8 V HSTL Interface ZQ controlled programmable output drivers Dual Cycle Deselect Fully coherent read and write pipelines Byte write operation (9-bit bytes) Differential HSTL clock inputs, K and K Asynchronous output enable Sleep mode via ZZ IEEE 1149.1 JTAG-compliant Serial Boundary Scan JEDEC-standard 119-bump BGA package Pb-Free 119-bump BGA package available 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM Functional Description 250 MHz–357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Because GS8150V18/36A are synchronous devices, address data inputs and read/write control inputs are captured on the rising edge of the input clock. Write cycles are internally selftimed and initiated by the rising edge of the clock input. This feature eliminates complex off-chip write pulse generation required by asynchronous SRAMs and simplifies input signal timing. GS8150V18/36A support pipelined reads utilizing a risingedge-triggered output register. They also utilize a Dual Cycle Deselect (DCD) output deselect protocol. GS8150V18/36A are implemented with high performance HSTL technology and are packaged in a 119-bump BGA. Family Overview GS8150V18/36A are 18,874,368-bit (18Mb) high performance SRAMs. This family of wide, very low volta...




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