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CSPEMI400 Dataheets PDF



Part Number CSPEMI400
Manufacturers California Micro Devices
Logo California Micro Devices
Description SIM Card EMI Filter Array
Datasheet CSPEMI400 DatasheetCSPEMI400 Datasheet (PDF)

www.DataSheet4U.com CSPEMI400 SIM Card EMI Filter Array with ESD Protection Features • • • • • • • Three channels of EMI filtering, each with ESD protection Two additional channels of ESD-only protection ±10kV ESD protection (IEC 61000-4-2, contact discharge) ±25kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Product Description CAMD's CSPEMI400 is an EMI filter array with ESD protection.

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www.DataSheet4U.com CSPEMI400 SIM Card EMI Filter Array with ESD Protection Features • • • • • • • Three channels of EMI filtering, each with ESD protection Two additional channels of ESD-only protection ±10kV ESD protection (IEC 61000-4-2, contact discharge) ±25kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Product Description CAMD's CSPEMI400 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CSPEMI400 has component values of 20pF-47Ω20pF, and 20pF-100Ω-20pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±10kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25kV. The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CSPEMI400 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CSPEMI400 is available in a space-saving, lowprofile Chip Scale Package with optional lead-free finishing. Applications • • • SIM Card slot in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data ports in cell phones, PDAs or notebook computers Electrical Schematic R1 A1 C C GND R1 A3 C C C3 A4 C C C4 C1 A2 C C R2 C2 B2,B4 © 2005 California Micro Devices Corp. All rights reserved. 09/28/05 R1=100Ω R2=47Ω 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 www.DataSheet4U.com CSPEMI400 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (Bumps Up View) 1 A B C 2 3 4 A4 A3 B2 C4 C3 C2 A2 B1 C1 A1 A1 Orientation Marking AG CSPEMI400 CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS TYPE EMI Filter EMI Filter Device Ground EMI Filter ESD Channel ESD Channel PIN A1 C1 A2 C2 B1 B2 A3 C3 A4 C4 DESCRIPTION EMI Filter with ESD Protection for RST Signal EMI Filter with ESD Protection for RST Signal EMI Filter with ESD Protection for CLK Signal EMI Filter with ESD Protection for CLK Signal Device Ground Device Ground DAT EMI Filter with ESD Protection DAT EMI Filter with ESD Protection ESD Proection Channel - VCC Supply ESD Proection Channel Ordering Information PART NUMBERING INFORMATION Standard Finish Bumps 10 Package CSP Ordering Part Number1 CSPEMI400 Part Marking AG Lead-free Finish2 Ordering Part Number1 CSPEMI400G Part Marking AG Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 09/28/05 www.DataSheet4U.com CSPEMI400 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL R1 R2 C VSTANDOFF ILEAK VSIG PARAMETER Resistance of R1 Resistance of R2 Capacitance Stand-off Voltage Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω VIN = 2.5VDC, 1MHz, 30mV ac I = 10μA VBIAS = 3.3V ILOAD = 10mA ILOAD = -10mA Notes 2,4 and 5 ±25 ±10 Notes 2,3,4 and 5 +12 -7 R = 100Ω, C = 20pF R = 47Ω, C = 20pF 77 85 V V MHz MHz kV kV 5.6 -1.5 6.8 -0.8 CONDITIONS MIN 80 38 16 TYP 100 47 20 6.0 300 9.0 -0.4 MAX 120 56 24 UNITS Ω Ω pF V nA V V VESD VCL fC1 fC2 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the op.


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