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IS45S16100C1

Integrated Silicon Solution

512K Words x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM

IS45S16100C1 512K Words x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM FEATURES • Clock frequency: 143 MHz • Full...


Integrated Silicon Solution

IS45S16100C1

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IS45S16100C1 512K Words x 16 Bits x 2 Banks (16-MBIT) SYNCHRONOUS DYNAMIC RAM FEATURES Clock frequency: 143 MHz Fully synchronous; all signals referenced to a positive clock edge Two banks can be operated simultaneously and independently Dual internal bank controlled by A11 (bank select) Single 3.3V power supply LVTTL interface Programmable burst length – (1, 2, 4, 8, full page) Programmable burst sequence: Sequential/Interleave 4096 refresh cycles every 64 ms Random column address every clock cycle Programmable CAS latency (2, 3 clocks) Burst read/write and burst read/single write operations capability Burst termination by burst stop and precharge command Byte controlled by LDQM and UDQM Automotive Temperature Range Option A: 0oC to +70oC Option A1: -40oC to +85oC Packages: 400-mil 50-pin TSOP-II, 60-ball fBGA Lead-free package option www.DataSheet4U.com ISSI JANUARY 2006 ® DESCRIPTION ISSI’s 16Mb Synchronous DRAM IS45S16100C1 is organized as a 524,288-word x 16-bit x 2-bank for improved performance. The synchronous DRAMs achieve high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. PIN CONFIGURATIONS 50-Pin TSOP (Type II) VDD DQ0 DQ1 GNDQ DQ2 DQ3 VDDQ DQ4 DQ5 GNDQ DQ6 DQ7 VDDQ LDQM WE CAS RAS CS A11 A10 A0 A1 A2 A3 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 GND...




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